Semiconductor Packaging (3D IC) Emerging As Innovation Enabler!

Semiconductor Packaging (3D IC) Emerging As Innovation Enabler!
by Daniel Nenni on 01-29-2012 at 4:00 pm

The ASIC business is getting more and more complicated. The ability to produce innovative die at a competitive price to solve increasingly complex problems just isn’t enough. The technology required to package that die is now front and center.

Here, at the junction of advanced design, process technology and state-of-the art … Read More