Fan-Out Wafer Level Processing Gets Boost from Mentor TSMC Collaboration

Fan-Out Wafer Level Processing Gets Boost from Mentor TSMC Collaboration
by Mitch Heins on 01-20-2017 at 12:00 pm

I caught up with John Ferguson of Mentor Graphics this week to learn more about a recent announcement that TSMC has extended its collaboration with Mentor in the area of Fan-Out Wafer Level Processing (FOWLP).

In March of last year Mentor and TSMC announced that they were collaborating on a design and verification flow for TSMC’s… Read More