In today’s rapidly advancing technological landscape, semiconductors are at the heart of innovation across diverse industries such as automotive, healthcare, telecommunications, and consumer electronics. As a leader in technology and engineering, Siemens plays a pivotal role in empowering the next generation … Read More
Chiplet and Heterogeneous Integration for Microelectronics Packaging – Virtual Training
Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging,
