International Conference on Synthesis, Modeling, Analysis and Simulation Methods, and Applications to Circuit Design
Themed Heterogeneous Integration: Bolstering Europe’s Resilience the 3D & Systems Summit 2025 will primarily focus on exploring strategies for enhancing Europe’s semiconductor industry addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications… Read More
HPC, AI, Quantum: Powering Innovation and Sustainability
ISC 2026 connects scientists, engineers, and technology leaders to explore the future of high performance computing. We will examine today’s breakthroughs in artificial intelligence, high performance computing and quantum technologies,
We are excited to announce the 30th Automobil-Elektronik Kongress, set to take place on June 16 and 17, 2026 at the Forum am Schlosspark in Ludwigsburg, Germany. This prestigious technical conference will bring together industry experts, researchers, and innovators to discuss the latest advancements in automotive electronics.… Read More
The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and industry associations. It offers unprecedented insight into the world of embedded systems, from components… Read More
Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. Although EOS and ESD damage can at times look quite similar to each other, the source each and the solution can be quite different. Therefore, it is important to be able to distinguish between… Read More
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability… Read More
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today’s application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on the stuck-at-fault (SAF) to model defect behavior. Unfortunately, the SAF… Read More
If you are in Europe then the CDNLive! EMEA user conference is in Munich at the Dolce Hotel from May 14th to 16th. Like last month’s CDNLive! in Cadence’s hometown San Jose, the conference focuses on sharing fresh ideas and best practices for all aspects of semiconductor design from embedded software down to bare silicon.… Read More
Although there has been always a strong relationship between ARM and GlobalFoundries, it is interesting to notice that Intel has helped to boost it and make it even stronger. Indeed when AMD renegotiated its x86 licensing deal with Intel in 2009, one of the most significant long-term changes was a marked reduction in how much of … Read More
