Dual Strategy of Electroless Metal Deposition and Surface Silylation Toward Scalable Low-Temperature Hybrid Bonding for Advanced Packaging Applications

Dual Strategy of Electroless Metal Deposition and Surface Silylation Toward Scalable Low-Temperature Hybrid Bonding for Advanced Packaging Applications
by Admin on 07-09-2025 at 8:00 am

Hybrid Bonding for Advanced Packaging

In extreme ultraviolet lithography (EUVL) systems, the collector mirror is a critical optical component that gathers and directs EUV light from the source toward the projection optics. Over time, the collector surface accumulates contaminant films — primarily tin (Sn) debris from the laser-produced plasma (LPP) source, … Read More


Advancing Semiconductor Processes with Novel Extreme UV Photoresist Materials

Advancing Semiconductor Processes with Novel Extreme UV Photoresist Materials
by Rupesh Yelhekar on 09-06-2023 at 10:00 am

Banner Advancing Semiconductor Processes with Novel Extreme UV Photoresist Materials

Introduction

The ever-growing demand for faster, smaller, and more efficient electronic devices has fueled the semiconductor industry’s relentless pursuit of innovation. One crucial technology at the heart of semiconductor manufacturing is Extreme Ultraviolet Lithography (EUVL) to achieve smaller feature sizes… Read More