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ESD Alliance CEO Outlook

ESD Alliance CEO Outlook
by Daniel Payne on 05-23-2019 at 5:30 pm

Join us for the ESD Alliance 2019 CEO Outlook Thursday, May 23, at SEMI in Milpitas, Calif. Our moderator, Ed Sperling, editor in chief of Semiconductor Engineering, will lead a discussion with our panelists John Chong, vice president of product and business development for Kionix, Jack Harding, president and CEO of eSilicon,… Read More

May 9, 2019

ESD Alliance CEO Outlook Features Powerhouse Lineup

ESD Alliance CEO Outlook Features Powerhouse Lineup
by Bob Smith on 05-09-2019 at 2:00 pm
Categories: ESD Alliance, Events, Semiconductor Services

Image RemovedJust two more weeks before the 2019 CEO Outlook Thursday, May 23, at SEMI. If you haven’t registered yet, do so today. We’re expecting a full house as a result of our powerhouse lineup and networking opportunities.

That lineup includes Ed Sperling, editor in chief of Semiconductor Engineering, who will serve as moderator.… Read More

April 5, 2019

The ESD Alliance Welcomes You to an Evening with Jim Hogan and Paul Cunningham

The ESD Alliance Welcomes You to an Evening with Jim Hogan and Paul Cunningham
by Bob Smith on 04-05-2019 at 7:00 am
Categories: ESD Alliance, Events, Semiconductor Services

Image RemovedAn informal “Fireside Chat” like no other featuring Jim Hogan, managing partner of Vista Ventures, LLC., and Paul Cunningham, Cadence’s corporate vice president and general manager of the system verification group, is in the works for Wednesday, April 10.

Hosted by the ESD Alliance, a SEMI Strategic Association… Read More

March 15, 2019March 17, 2019

China Innovation Forum and ES DESIGN West

China Innovation Forum and ES DESIGN West
by Daniel Nenni on 03-15-2019 at 7:00 am
Categories: ESD Alliance, Events, Semiconductor Services

I had a chat with Bob Smith, Executive Director of ESD Alliance, about the upcoming SEMI conference in China. More than 100,000 people are expected to attend which is beyond my comprehension. SEMICON in San Francisco is maybe 20,000 people which is the largest conference I attend. I’m not sure if the Design Automation Conference… Read More

February 26, 2019October 11, 2019

Interview with Bob Smith, Executive Director of the ESD Alliance

Interview with Bob Smith, Executive Director of the ESD Alliance
by Daniel Nenni on 02-26-2019 at 7:00 am
Categories: ESD Alliance, Events, Semiconductor Services
1 Comment

Image RemovedBob Smith is executive director of the ESD (for electronic system design) Alliance that many Semiwiki readers will remember as the EDA Consortium. As Bob explains, the semiconductor industry is changing and evolving, and the electronic system design ecosystem with it. I encourage you to take a break from what you’… Read More

April 6, 2018

EDA CEO Outlook 2018

EDA CEO Outlook 2018
by Daniel Nenni on 04-06-2018 at 12:00 pm
Categories: EDA, Events

The EDA CEO outlook took an interesting turn last night but before I get into that I will offer a few comments about the start of the show. I attend this event every year for the content but also for the networking. It isn’t everyday you get to hang out with semiconductor industry elite and have candid conversations over food and drinks.… Read More

June 22, 2016June 14, 2019

Semiconductor IP QA Standards Get a Boost at #53DAC

Semiconductor IP QA Standards Get a Boost at #53DAC
by Daniel Payne on 06-22-2016 at 12:00 pm
Categories: EDA, Events, Fractal Technologies

At the #53DAC earlier this month held in Austin, Texas I met up with Renee Donkers, the founder of Fractal Technologies. His company has been focused on improving the quality of semiconductor IP cells through the use of automated checking software. The highest area of growth in EDA as measured by the ESD Alliance is in the reusable… Read More

Instance

Array
(
    [node_name] => esd alliance
    [node_id] => Array
        (
            [0] => 2
            [1] => 283
        )

)

Nodes

Threads

Response to IP’s Growing Impact On Yield And Reliability
"Excellent article, even for the outsider like me, Thanks."

— Arthur Hanson on October 15, 2019
Acceleration in a Heterogenous Compute Environment
"Interesting note. Thanks for the reference"

— Bernard Murphy on October 14, 2019
Acceleration in a Heterogenous Compute Environment
"Been there... Inmos in the UK tackled the parallel computing problem with CSP back in the 1980s.…"

— simguru on October 14, 2019
Crashing the Mars Rovers!!! Actel and Aerospace Corp
"Hi mike. Glad to hear you saw it that way!!"

— John East on October 12, 2019
Crashing the Mars Rovers!!! Actel and Aerospace Corp
"I recall bragging regularly when I was there to various audiences that Actel devices were on board every lander that…"

— Mike Brogley on October 11, 2019
5G Deployments – The Analysis Requirements are Ginormous
"Some cities are still in the stone age and will take years to just get up to current standards.…"

— Arthur Hanson on October 10, 2019
Acceleration in a Heterogenous Compute Environment
"Very interesting blog. It makes a lot of sense to split up tasks to the most efficient hardware using…"

— Arthur Hanson on October 10, 2019
A Review of TSMC’s OIP Ecosystem
"Is it intentional to show "N10 Full-Coloring Custom Design Flow" slide in Fig 5 ? :)"

— hsienhsinlee on October 9, 2019
A Future Vision for 3D Heterogeneous Packaging
"I guess InFO would reduce latency between chiplets. That would be very useful for AMD's new server CPUs. High latency…"

— lefty on October 9, 2019
A Future Vision for 3D Heterogeneous Packaging
"Yes I do believe TSMC is racing ahead, a generation or two for sure. The entire ecosystem is collaborating with…"

— Daniel Nenni on October 8, 2019

Tribe__Events__List_Widget Instance: 5Array ( [title] => Upcoming Events [limit] => 5 [no_upcoming_events] => [featured_events_only] => [jsonld_enable] => 1 [rw_opt] => Array ( [widget_select] => 1 [cpt_page] => 1 [others_author_archive] => 1 [others_404_page] => 1 [others_blog_page] => 1 ) [display_widget_mobile] => 1 )

Upcoming Events

WP_Widget_Search Instance: 2Array ( [display_widget_title] => on [title] => Search Semiwiki [rw_opt] => Array ( [widget_select] => 1 [others_blog_page] => 1 [others_author_archive] => 1 [others_404_page] => 1 [cpt_page] => 1 ) [display_widget_mobile] => 1 [rw_opt_exclude] => Array ( [pageid_274495] => 1 ) )

WP_Widget_Media_Image Instance: 8Array ( [display_widget_title] => on [attachment_id] => 275190 [url] => https://semiwiki.com/wp-content/uploads/2019/09/Threshold-Systems-Ad-300x300.jpg [title] => Home/Default Page Advertisement 4 [size] => medium [width] => 400 [height] => 400 [caption] => [alt] => [link_type] => custom [link_url] => https://secure.thresholdsystems.com/Training/AdvancedCMOSTechnology.aspx [image_classes] => [link_classes] => [link_rel] => [link_target_blank] => [image_title] => Home/Default Page Advertisement 4 [display_widget_mobile] => [rw_opt] => Array ( [widget_select] => 1 [category_96] => 1 [category_14325] => 1 [category_6435] => 1 [category_95] => 1 [category_157] => 1 [category_50] => 1 [category_90] => 1 [category_151] => 1 [category_386] => 1 [others_front_page] => 1 [others_blog_page] => 1 ) )

WP_Widget_Text Instance: 6Array ( [title] => [text] =>

Concerned about IP security threats for your SoCs? Achronix: Accelerate Data Processing Algorithms using FPGAs with 2D Network-on-Chip PAVE360: Of SoCs, Digital Twins, and Validating Autonomous Vehicle Behavior Thermal-induced Reliability Challenges and Solutions for Advanced IC Design REPLAY: GPU-Powered SPICE: The Way Forward for Analog Simulation REPLAY: Avoiding CDM (Charged Device Model) ESD Failures REPLAY: eFPGA – "What a great idea! But I have no idea how I’d use it!" REPLAY: Ensuring System-level Security Through Hardware/Software Security Verification REPLAY: Fabless: The Transformation of the Semiconductor Industry REPLAY: The Brave New World of Customized Memory REPLAY: Embedded FPGA: The Fabric for Optimized Machine Learning REPLAY: VLSI Design Methodology Development REPLAY: Lightspeed Data Sync - Design Workspace Problems Solved! REPLAY: Desinging Complex SoCs and Dealing with Multiple File Formats? REPLAY: How ASIC/SoC Prototyping Solutions Can Help You! REPLAY: Reusing Your IPs & PDKs Successfully With Cadence® Virtuoso® REPLAY: Taiwan ESD Workshop Recording REPLAY: Reduce Risk and Improve Quality of AMS IP’s using AI-Powered Automated Timing Arc Prediction REPLAY: Text: A Year of Breakfast Bytes by Paul McLellan (Free PDF Version) REPLAY: Finding Your Way Through Verification [filter] => 1 [visual] => 1 [rw_opt] => Array ( [widget_select] => 1 [others_front_page] => 1 [category_96] => 1 [category_6435] => 1 [category_95] => 1 [category_157] => 1 [category_50] => 1 [category_13] => 1 [category_90] => 1 [category_89] => 1 [category_3611] => 1 [category_178] => 1 [category_14418] => 1 [category_51] => 1 [category_97] => 1 [cpt_page] => 1 [others_blog_page] => 1 [category_44] => 1 [category_5] => 1 [category_32] => 1 [category_22] => 1 ) [display_widget_mobile] => 1 )

Recent_Posts_Widget_Extended Instance: 9Array ( [title] => Trending Now [title_url] => [ignore_sticky] => 1 [exclude_current] => 1 [limit] => 5 [offset] => 10 [order] => DESC [orderby] => date [post_type] => Array ( [0] => post ) [post_status] => publish [cat] => Array ( ) [tag] => Array ( ) [taxonomy] => [excerpt] => [length] => 10 [date] => [date_relative] => [date_modified] => [readmore] => [readmore_text] => Read More [comment_count] => [thumb] => [thumb_height] => 55 [thumb_width] => 55 [thumb_default] => http://images/semiwiki-small.png [thumb_align] => rpwe-alignleft [styles_default] => 1 [cssID] => [css_class] => [css] => .rpwe-block ul{ list-style: none !important; margin-left: 0 !important; padding-left: 0 !important; } .rpwe-block li{ border-bottom: 1px solid #eee; margin-bottom: 10px; padding-bottom: 10px; list-style-type: none; } .rpwe-block a{ display: inline !important; text-decoration: none; } .rpwe-block h3{ background: none !important; clear: none; margin-bottom: 0 !important; margin-top: 0 !important; font-weight: 400; font-size: 12px !important; line-height: 1.5em; } .rpwe-thumb{ border: 1px solid #eee !important; box-shadow: none !important; margin: 2px 10px 2px 0; padding: 3px !important; } .rpwe-summary{ font-size: 12px; } .rpwe-time{ color: #bbb; font-size: 11px; } .rpwe-comment{ color: #bbb; font-size: 11px; padding-left: 5px; } .rpwe-alignleft{ display: inline; float: left; } .rpwe-alignright{ display: inline; float: right; } .rpwe-aligncenter{ display: block; margin-left: auto; margin-right: auto; } .rpwe-clearfix:before, .rpwe-clearfix:after{ content: ""; display: table !important; } .rpwe-clearfix:after{ clear: both; } .rpwe-clearfix{ zoom: 1; } [before] => [after] => [rw_opt] => Array ( [widget_select] => 1 [others_front_page] => 1 [others_author_archive] => 1 [others_404_page] => 1 ) )

GTranslateWidget Instance: 3Array ( [title] => Google Translate [rw_opt] => Array ( [others_front_page] => 1 [others_author_archive] => 1 [others_404_page] => 1 [widget_select] => 1 ) [display_widget_mobile] => )

XF2_Latest_Posts_Widget Instance: 2Array ( [title] => Recent Forum Threads [title_url] => [ignore_sticky] => 0 [exclude_current] => 0 [limit] => 10 [offset] => 0 [order] => [orderby] => ID [post_type] => Array ( [0] => post ) [post_status] => [cat] => Array ( ) [tag] => Array ( ) [taxonomy] => [excerpt] => [length] => 0 [date] => [date_relative] => [date_modified] => [readmore] => [readmore_text] => [comment_count] => [thumb] => [thumb_height] => 0 [thumb_width] => 0 [thumb_default] => [thumb_align] => [styles_default] => [cssID] => [css_class] => [css] => [before] => [after] => [display_widget_mobile] => 1 [rw_opt] => Array ( [widget_select] => 1 [others_front_page] => 1 [pageid_274495] => 1 ) [sluglist] => ["jobs-dashboard"] [rw_opt_exclude] => Array ( [pageid_274493] => 1 ) )

Widget_Better_Recent_Comments Instance: 2Array ( [title] => Recent Article Comments [number] => 10 [avatar] => [date] => 1 [comment] => 1 [link] => 1 [display_widget_mobile] => 1 [rw_opt] => Array ( [widget_select] => [pageid_274493] => 1 ) [rw_opt_exclude] => Array ( ) )

Tag: esd alliance

ESD Alliance CEO Outlook

ESD Alliance CEO Outlook Features Powerhouse Lineup

The ESD Alliance Welcomes You to an Evening with Jim Hogan and Paul Cunningham

China Innovation Forum and ES DESIGN West

Interview with Bob Smith, Executive Director of the ESD Alliance

EDA CEO Outlook 2018

Semiconductor IP QA Standards Get a Boost at #53DAC

Upcoming Events

S3S (SOI-3D-subthreshold) Conference

DataConnectors Toronto

FD-SOI Short Course (San Jose)

ClioSoft Webinar: Designing on AWS

VSDOpen Conference 2019 (Online)

Search Semiwiki

Recent esd alliance Press

ESD ALLIANCE REPORTS EDA INDUSTRY REVENUE INCREASE FOR Q2 2019

ESD ALLIANCE REPORTS EDA INDUSTRY REVENUE INCREASE FOR Q1 201

ES Design West Opens July 9 at SEMICON West 2019 in San Francisco

Design Automation Conference, World’s Premier Electronics System Design Event, to Co-Locate with SEMICON West in 2020

Simon Segars of Arm Named Chair of ESD Alliance Governing Council

ESD Alliance Elects 10-Member Governing Council

ES Design West Exhibitor List Grows with Ansys, Breker, ClioSoft, Coventor, Methodics, OneSpin, Real Intent, Rescale, Silvaco

HOT Party Debuts at ES Design West, SEMICON West to Benefit SEMI Foundation

EDA INDUSTRY REVENUE GROWS FOR FULL YEAR 2018 BUT SLOWS FOR FOURTH QUARTER

ESD ALLIANCE REPORTS EDA INDUSTRY REVENUE INCREASE FOR Q3 2018

Recent Article Comments

Response to IP’s Growing Impact On Yield And Reliability

Acceleration in a Heterogenous Compute Environment

Acceleration in a Heterogenous Compute Environment

Crashing the Mars Rovers!!! Actel and Aerospace Corp

Crashing the Mars Rovers!!! Actel and Aerospace Corp

5G Deployments – The Analysis Requirements are Ginormous

Acceleration in a Heterogenous Compute Environment

A Review of TSMC’s OIP Ecosystem

A Future Vision for 3D Heterogeneous Packaging

A Future Vision for 3D Heterogeneous Packaging