Overcoming System-Level 3D-IC Electrical and Thermal Challenges

Overcoming System-Level 3D-IC Electrical and Thermal Challenges
by Admin on 04-06-2022 at 10:00 am

Overview

Electronics products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise.

Addressing these concerns through simulation during system planning and continuing through signoff will accelerate… Read More