Heat and semiconductor reliability exist in an inversely proportional relationship. Before the breaking point at the thermal junction temperature rating, every 10°C rise in steady-state temperature cuts predicted MOSFET life in half. Yet, heat densities rise as devices plunge into harsher environments like smartphones,… Read More
Webinar: Powering 3D Multi-Die Designs with RedHawk-SC Electrothermal
As semiconductors continue to scale, designers are turning to 3DIC architectures to meet increasing demands for performance, energy efficiency, and functional density in data centers and edge AI applications. However, stacking multiple dies introduces new multiphysics challenges including electrical, structural, and… Read More