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Heat and semiconductor reliability exist in an inversely proportional relationship. Before the breaking point at the thermal junction temperature rating, every 10°C rise in steady-state temperature cuts predicted MOSFET life in half. Yet, heat densities rise as devices plunge into harsher environments like smartphones,… Read More
Conference Date: June 02, 2022
Meeting time: 14:00 – 15:00 (Beijing time)
Traditional thermal simulation software often focuses on the heating of the device itself, and is not very friendly to the processing of circuit Joule heat. However, for some scenarios with high power consumption and high current, the influence
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