You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
#61DAC was buzzing this year with talk of AI and multi-die, heterogeneous design. The promise of making 2.5/3D design and a chiplet ecosystem mainstream reality was the focus of a lot of the panels and presentations at the conference. AI is certainly a driver for this new design style, but the conversation was broader than just AI,… Read More
“Innovations for Next Generation Scaling”
The 2013 Forum today (Feb 5, 2013) started with a presentation by Dr. Gary Patton, VP, IBM Semiconductor Research & Development Center. Gary very clearly articulated the two irresolvable challenges the industry now faces:
- On chip interconnect
- Lithography
These … Read More
