Tracing Technology’s Evolution with Patents

Tracing Technology’s Evolution with Patents
by Arabinda Das on 04-23-2020 at 10:00 am

Figure 1

We live in an age of abundant information. There is a tremendous exchange of ideas crisscrossing the world enabling new innovative type of products to pop up daily. Therefore, in this era there is a greater need to understand competitive intelligence. Corporate companies today are interested in what other competitors are brewing… Read More


TechInsights Gives Memory Update at IEDM18 NAND Flash

TechInsights Gives Memory Update at IEDM18 NAND Flash
by BHD on 04-15-2019 at 12:00 pm

On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees. Arabinda was first up, giving a talk on the “10-year Journey of Apple’s iPhone and Innovations in Semiconductor Technology”, followed by Jeongdong… Read More


The Answer to Why Intel PMOS and NMOS Fins are Different Sizes

The Answer to Why Intel PMOS and NMOS Fins are Different Sizes
by Jerry Healey on 04-08-2019 at 7:00 am

Like many others, we have often wondered why the PMOS fins on advanced microprocessors from Intel are narrower than the NMOS fins (6nm versus 8nm). This unusual dimensional difference first occurred at the 14nm node and it coincided with the introduction of Solid State Doping (SSD) of the fins at this node.


We have concluded that… Read More


High Density Advanced Packaging Trends

High Density Advanced Packaging Trends
by Mitch Heins on 07-19-2017 at 7:00 am

Thursdays at the Design Automation Conference (DAC) are always a good time to catch up on areas of technology which are adjacent to that which you normally work. The exhibit floor is over and you have more time to spend in seminars. At this year’s DAC, I took advantage of a half day seminar put on by Mentor, a Siemens business, … Read More