The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation

The Impact of UCIe on Chiplet Design: Lowering Barriers and Driving Innovation
by Kalar Rajendiran on 08-15-2024 at 6:00 am

Comparative Analysis of Chiplet Interconnect Standards (Physical Layer)

The semiconductor industry is experiencing a significant transformation with the advent of chiplet design, a modular approach that breaks down complex chips into smaller, functional blocks called chiplets. A chiplet-based design approach offers numerous advantages, such as improved performance, reduced development … Read More


Navigating the 1.6Tbps Era: Electro-Optical Interconnects and 224G Links

Navigating the 1.6Tbps Era: Electro-Optical Interconnects and 224G Links
by Kalar Rajendiran on 02-22-2024 at 6:00 am

Simulation and Silicon ADC outpit scatter plot

In the relentless pursuit of ever-increasing data speeds, the 1.6 Terabits per second (Tbps) era looms on the horizon, promising unprecedented levels of connectivity and bandwidth within data centers. As data-intensive applications proliferate and the demand for real-time processing escalates, the need for robust and efficient… Read More


How to Efficiently and Effectively Secure SoC Interfaces for Data Protection

How to Efficiently and Effectively Secure SoC Interfaces for Data Protection
by Kalar Rajendiran on 01-04-2023 at 6:00 am

secure interfaces article fig1

Before the advent of the digitized society and computer chips, things that needed protection were mostly hard assets such as jewelry, coins, real estate, etc. Administering security was simple and depended on strong guards who provided security through physical means. Then came the safety box services offered by financial … Read More


OpenFive Joins Universal Chiplet Interconnect Express (UCIe) Consortium

OpenFive Joins Universal Chiplet Interconnect Express (UCIe) Consortium
by Kalar Rajendiran on 07-19-2022 at 10:00 am

Snapshot of Contributing Members of UCIe

Universal Chiplet Interconnect Express (UCIe) is an open specification that defines the interconnect between chiplets within a package. The objective is to enable an open chiplet ecosystem. Although the initial specification for UCIe was developed by Intel, a consortium was announced in March with Intel, AMD, Arm, Google,… Read More


Alchip Technologies Offers 3nm ASIC Design Services

Alchip Technologies Offers 3nm ASIC Design Services
by Kalar Rajendiran on 07-14-2022 at 10:00 am

Alchip Design Technology Roadmap

Throughout its history, the ASIC industry has had its ups and downs. With feast and famine cycles, the ASIC business model is not for the faint of heart. Some companies tread boldly while others dread the cycles and stay away from this business model. Those who are consistently successful have to overcome many challenges thrown … Read More