The IEEE Interconnect Technology Conference (IITC): Advanced Metallization Conference was held June 4th through 7th in Santa Clara. Imec presented multiple papers on comparing copper, cobalt and ruthenium interconnect. One paper in particular caught my eye: Marleen H. van der Veen, # N. Heylen, O. Varela Pedreira, S. Decoster,… Read More
Webinar: From Copper to COUPE: Scaling AI Interconnects with Co-Packaged Optics
Featured Speakers:
- Igor Elkanovich, CTO, GUC
- Sheng-Fan Yang, Director, GUC
- Madhumita Sanyal, Sr. Director Product Management, Synopsys
Co-packaged optics (CPO) breaks through the data movement constraint by moving optical engines next to the XPU, reducing electrical reach from centimeters to millimeters and delivering