Tackling Manufacturing Errors Early with CMP Simulation

Tackling Manufacturing Errors Early with CMP Simulation
by Alex Tan on 12-28-2018 at 12:00 pm

Image RemovedCMP (Chemical Mechanical Planarization or also known as Chemical Mechanical Polishing) is a wafer fabrication step applied generally after a chemical deposition –intended to smoothen and to flatten (planarize) wafer surfaces with the combination of chemical and mechanical forces. Developed at IBM and since… Read More