3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hiearchical Analysis
Overview
A 3D-IC includes the package, interposer, multiple chiplets, through-silicon vias (TSVs), and through-dielectric vias (TDVs). Supplying power to the chiplets and dissipating heat through these various components poses a major power integrity (PI) and thermal integrity challenge. Early analysis also is extremely… Read More