3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hiearchical Analysis

3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hiearchical Analysis
by Admin on 03-23-2022 at 12:00 am

Overview

A 3D-IC includes the package, interposer, multiple chiplets, through-silicon vias (TSVs), and through-dielectric vias (TDVs).  Supplying power to the chiplets and dissipating heat through these various components poses a major power integrity (PI) and thermal integrity challenge. Early analysis also is extremely… Read More