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Background
The emergence of 2.5D heterogeneous die integration using a silicon (or organic) interposer has enabled unique system architectures. The term “More than Moore” has been used to describe the circuit density and cost advantages of leveraging multiple die in the package, the die potentially in different process technologies. … Read More
Overview
Join us to fully understand the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems. Learn how the Cadence Celsius™ Thermal Solver helps you solve this problem by producing thermal gradient for the whole system, enabling analysis from early design to signoff.
Takeaways:
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