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With the increase of transistors per unit area, high density interconnects and manufacturing variability at lower nodes, the electronic devices have become more vulnerable to failures. The devices that operate under extreme conditions such as automotive devices that operate at high temperatures need to be robust enough to… Read More
This year’s Kaufman award winner is Chenming Hu. In contrast to previous years, this was presented on the Sunday evening of DAC instead of at a separate event in San Jose. Chenming’s career was reviewed by Klaus Schuegraf, Group Vice President of EUV Product Development at Cymer, Inc (now part of ASML) and also one of… Read More
