A Practical Approach to Better Thermal Analysis for Chip and Package

A Practical Approach to Better Thermal Analysis for Chip and Package
by Daniel Nenni on 12-13-2021 at 6:00 am

ANSYS Thermal Chip Model

Thermal modeling has become a hot topic for designers of today’s high-speed circuits and complex packages. This has led to the adoption of better and more sophisticated thermal modeling tools and flows as exemplified in this presentation by Micron at the IDEAS Digital Forum. The presentation is titled “Thermal Aware Memory ControllerRead More