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The complexity of an SoC design necessitates that the project managers have accurate visibility into the overall design status, spanning the entire range of tasks – from functional simulation error triage, to physical layout verification errors, to electrical analysis results. Flow scripts used by SoC teams parse the log file… Read More
Integrated wafer-level fanout (WLFO) packaging technology is emerging as a foundation for multi-die solutions. Mobile product applications require focus on both aggressive chip-to-chip interface performance, as well as the final package volume. Traditional multi-chip packages using PCB laminate substrates do not readily… Read More
