The adoption of 3DIC architectures, while not new, is enjoying a surge in popularity as product developers look to their inherent advantages in performance, cost, and the ability to combine heterogeneous technologies and nodes into a single package. As designers struggle to find ways to scale with complexity and density limitations… Read More
Podcast EP223: The Impact Advanced Packaging Will Have on the Worldwide Semiconductor Industry with Bob Patti
Dan is joined by Bob Patti, the owner and President of NHanced Semiconductors. Previously, Bob founded ASIC Designs Inc., an R&D company specializing in high-performance systems and ASICs. During his 12 years with ASIC Designs he participated in more than 100 tapeouts. Tezzaron Semiconductor grew from that company, with… Read More