Thermal Issues and Solutions for 3D ICs: Latest Updates and Future Prospect

Thermal Issues and Solutions for 3D ICs: Latest Updates and Future Prospect
by Mike Gianfagna on 02-26-2020 at 10:00 am

2D vs. 3D heat maps

At DesignCon 2020, ANSYS held a series of sponsored presentations. I was able to attend a couple of them.  These were excellent events with the material delivered by talented and high-energy speakers. The DesignCon technical program has many dimensions beyond the conference tracks. One of the presentations dealt with 3D ICs.… Read More


Cadence Celsius Heats Up 3D System-Level Electro-Thermal Modeling Market

Cadence Celsius Heats Up 3D System-Level Electro-Thermal Modeling Market
by Tom Simon on 09-24-2019 at 6:00 am

A few years back people were saying that the “EDA” problem was solved and that design tools had become commodity. At the same time people hailed ADAS, smart homes, mobile communication and AI as the frontiers of electronics.  Perhaps it could be said that layout tools, routers, placers, and circuit simulators had largely matured… Read More