DFT Moves up to 2.5D and 3D IC

DFT Moves up to 2.5D and 3D IC
by Daniel Payne on 10-06-2022 at 10:00 am

2.5D and 3D chiplets min

The annual ITC event was held the last week of September, and I kept reading all of the news highlights from the EDA vendors, as the time spent on the tester can be a major cost and the value to catching defective chips from reaching production is so critical. Chiplets, 2.5D and 3D IC design have caught the attention of the test world, … Read More