2.5D/3D IC Packaging Verification

2.5D/3D IC Packaging Verification
by Daniel Payne on 08-07-2019 at 10:00 am

Overview

Do you want to find out, hands-on, how many of the leading fabless semiconductor companies are verifying their complex 2.5/3D heterogeneous and homogeneous package assemblies?  Here is your chance to meet our technical staff and ask your questions.  Come and see why fabless semiconductor companies are adopting this… Read More