Podcast EP224: An Overview of the Upcoming 2024 Electronic Components and Technology Conference with Dr. Michael Mayer
Dan is joined by Dr. Michael Mayer, the 2024 Electronic Components and Technology Conference (ECTC) Program Chair. Michael is an Associate Professor in the department of Mechanical and Mechatronics Engineering at the University of Waterloo in Ontario, Canada. Michael has co-authored technical publications and patents about wire bonding methods and various microsensor tools for diagnostics of bonding processes, as well as reliability of micro joints. More recently he has been working on direct bonding of optical glasses and laser joining of biological materials.
Michael discusses the upcoming ECTC conference with Dan. The event will take place May 28 – 31, 2024 in Denver, Colorado. Michael discusses some of the innovation trends such as hybrid bonding presented at ECTC and how these technologies are paving the way for 2.5/3D heterogeneous integration. Michael provides an overview of the broad research in design, packaging and manufacturing that is presented at the conference.
Michael also discusses the trends in university research for advanced materials and packaging and highlights the more than 10 professional development courses available at the upcoming ECTC.
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