Podcast EP186: The History and Design Impact of Glass Substrates with Intel’s Dr. Rahul Manepalli
Dan is joined by Dr. Rahul Manepalli. Rahul is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization. Rahul and his team are responsible for developing the next generation of materials, processes and equipment for Intel’s package substrate pathfinding and development efforts. He has been with Intel for over 23 years
Intel Ushers a New Era of Advanced Packaging with Glass Substrates
Rahul recounts the R&D efforts that Intel invested in glass substrates over the past decade. He details the challenges of bringing this material to the mainstream, with reliable handling being a major focus The performance, flexibility and scaling benefits of glass substrates are also discussed, along with a forward view of production deployment.
The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.
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