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Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation

Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation
by Daniel Nenni on 12-18-2023 at 10:00 am

New CEVA Logo
Company sharpens its strategy of delivering silicon and software IP that makes it possible for low power Edge AI devices to connect, sense and infer data, reliably and efficiently, across multiple high-growth end markets

Ceva Inc. is an interesting company. Founded in November 2002, through the combination of the DSP IP licensing… Read More


Samtec Welcomes You to the Future with Proven 224G PAM4 Interconnect Solutions

Samtec Welcomes You to the Future with Proven 224G PAM4 Interconnect Solutions
by Mike Gianfagna on 12-18-2023 at 8:00 am

Samtec Welcomes You to the Future with Proven 224G PAM4 Interconnect Solutions

We all know about the relentless march of Moore’s Law. Denser, faster, and cheaper semiconductor devices that fuel the innovations that surround us. For this discussion, I will lump the significant movement from single chip advances to multi-chip strategies into a single thread as devices continue to get smaller, faster and … Read More


IEDM: TSMC Ongoing Research on a CFET Process

IEDM: TSMC Ongoing Research on a CFET Process
by Paul McLellan on 12-18-2023 at 6:00 am

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I attended the recent International Electron Devices Meeting (IEDM) last week. Many of the sessions are too technical and too far away from high volume manufacture to make good topics for a blog post. As a Fellow from IBM said about 5nm at and earlier IEDM, “none of these ideas will impact 5nm. It takes ten years for a solution to from… Read More


Podcast EP198: How Lightmatter Creates the Foundation for the Next Moore’s Law with Ritesh Jain

Podcast EP198: How Lightmatter Creates the Foundation for the Next Moore’s Law with Ritesh Jain
by Daniel Nenni on 12-15-2023 at 10:00 am

Dan is joined by Ritesh Jain. Ritesh is the senior vice president of engineering and operations for Lightmatter. Prior to joining Lightmatter, Ritesh was a vice president in Intel’s Data Center and AI group where he directed the hardware development across silicon packaging, power integrity, signal integrity, mechanical &… Read More


CEO Interview: Sridhar Joshi of TenXer

CEO Interview: Sridhar Joshi of TenXer
by Daniel Nenni on 12-15-2023 at 6:00 am

Sreedhar Pic

Sridhar Joshi has more than Two and half decades of experience in the Semiconductor Industry. He spent Large part of his career working in various Engineering and leadership roles at National Semiconductor and Texas Instruments, including leading a company wide initiative for System Design and Technology, ARM Microcontroller… Read More


An Insider’s View of the 2023 Global Semiconductor Alliance’s (GSA) Annual Awards

An Insider’s View of the 2023 Global Semiconductor Alliance’s (GSA) Annual Awards
by Daniel Nenni on 12-14-2023 at 10:00 am

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My beautiful wife and I attended the annual Global Semiconductor Alliance (GSA) Awards event last week. Usually this is a solo event but since my wife is CFO of SemiWiki I was able to get her an invite. I go every year and she wanted to see what all of the excitement was about. She also knows quite a few industry people from attending the… Read More


WEBINAR: FPGA-Accelerated AI Speech Recognition

WEBINAR: FPGA-Accelerated AI Speech Recognition
by Don Dingee on 12-14-2023 at 6:00 am

Cloud ASR demo on Speedster 7t FPGA

The three-step conversational AI (CAI) process – automatic speech recognition (ASR), natural language processing, and text-to-synthesized speech response – is now deeply embedded in the user experience for smartphones, smart speakers, and other devices. More powerful large language models (LLMs) can answer more queries… Read More


RISC-V and Chiplets: A Panel Discussion

RISC-V and Chiplets: A Panel Discussion
by Paul McLellan on 12-13-2023 at 10:00 am

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At the recent RISC-V Summit, the very last session was a panel about chiplets called Chiplets in the RISC-V Ecosystem. It was moderated by Calista Redmond, the CEO of RISC-V International. The panelists were:

  • Laurent Moll, COO of Arteris
  • Aniket Saha, VP of Product Management of Tenstorrent
  • Dale Greenley, VP of Engineering of Ventana
Read More

When Will Structured Assembly Cross the Chasm?

When Will Structured Assembly Cross the Chasm?
by Bernard Murphy on 12-13-2023 at 6:00 am

Trends in assembly min

First, a quick definition. By “structured assembly,” I mean the collection of tools to support IP packaging with standardized interfaces, SoC integration based on those IPs together with bus fabric and other connectivity hookups, register definition and management in support of hardware/software interface definition, Read More


Using PCB Automation for an AI and Machine Vision Product

Using PCB Automation for an AI and Machine Vision Product
by Daniel Payne on 12-12-2023 at 10:00 am

machine vision testing

I knew that HDMI was a popular standard used to connect consumer products like a monitor to a laptop, but most professional video and broadcast systems use the SDI (Serial Digital Interface) connector standard. Pleora Technologies, founded in 2000, currently serves the machine vision and manufacturing markets, including those… Read More