Senior Director, Module Development Engineering

Job Description:

Leads a team of module development engineers to drive technology development and enablement, provide integrated process solutions, and perform feasibility studies to meet desired device specifications while maximizing safety, quality, and process capabilities of wafer processing, assembly/test, and module repair factories. Ensures execution of module improvement responsibilities such as equipment ownership and oversees process and equipment in a manufacturing line. Leads growth of manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to manufacturing sites across the globe. Drives cross-organizational alignment towards process-pathway solutions. Deeply partners with integration, device, and yield engineering teams to build robust process solutions that will help deliver to power-performance and area leadership with technology structural cost in mind. Partners with supplier executive management to identify, nurture, develop, and implement unique research/industry ideas to life. Coaches and leads engineering teams to reverse engineer and/or develop repair and improvement opportunities to improve cost, output, and yield. Hires, manages, and coaches engineers on advanced technology development, building a holistic view for subject matter expertise. Develops long-term strategies for module engineering capabilities to support future requirements. Responsible for enabling teams to execute through clear goal setting, facilitating work, maintaining accountability, applying differentiated performance management, and driving team results. Drives results by inspiring people, role modeling Intel values, developing the capabilities of others, and ensuring a productive work environment.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• 14 years of relevant work experience in the semiconductor space
• Masters Degree in Electrical Engineering or Technical Equivalent
• Prior senior management with large, multi-national manufacturing employers, preferably in high technology/scientific/semiconductor sectors with prior specialization in technology development.
• Strong history of industry experience in process development, leadership, and semiconductor process, with an emphasis on etch processes.
• Background working with a combination of investors and third- party suppliers on solution optimization/customization to meet their manufacturing needs.
• Engineering group leader background at global scale including leading significant factory ramp-up and process technology development in high volume manufacturing environments.
• Extensive experience in fab start-up with technical track record in multiple areas of semi-conductor sector in areas such as manufacturing engineering, quality and reliability, research and development, sourcing/supply chain innovations etc.

Preferred Qualifications

• Substantial technical background in area of specialization i.e. logic technology and development, packaging, silicon process technologies, etc., with a body of research and patents.
• Demonstrated history of delivering customized solutions in Research and Development and HVM organizations.
• Previous related work experience in a semiconductor foundry preferred

  Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

US, Oregon, Hillsboro