Product Engineer (PE)

Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.

Job Responsibilities

1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement.

2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution.

3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue.

4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of “More than Moore”. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology

Job Qualifications

1. Master’s degree or above in Electrical Engineering, Physics, Material and Photonics.

2. Familiar with semiconductor devices / manufacturing, Electronics, and circuit design.

3. Willing to learn new knowledge, good self-learning attitude, enjoy challenge.

4. Good communication skills, be able to work with cross-functional teams & customers.

5. Fluent in English.