Materials and Failure Analysis Engineer

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading-edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.

As a Materials and Failure Analysis Engineer, you will play a critical role in supporting advanced semiconductor manufacturing technologies (5nm, 4nm, 3nm, and beyond). You will leverage your expertise in material analysis techniques to conduct detailed investigations, maintain laboratory equipment, and ensure smooth operations in a fast-paced manufacturing environment. Your work will directly contribute to the success of TSMC Arizona’s cutting-edge semiconductor processes and the company’s commitment to excellence.

Responsibilities

• Conduct materials and failure analysis to support advanced semiconductor manufacturing technologies (5nm, 4nm, 3nm, and below).
• Interface with customers and stakeholders across the factory, including:
  • Interpreting customer requests and aligning on optimal approaches.
  • Executing work-in-progress (WIP) tasks in the lab.
  • Drawing actionable conclusions from data and effectively communicating results.
• Participate in customer meetings and task forces to provide detailed interpretation of results and resolve complex issues.
• Perform tool maintenance and preventive maintenance (PM) on lab equipment to ensure optimal performance and minimize downtime.
• Troubleshoot and resolve equipment issues, including SIMS, XPS, and Auger Electron Spectroscopy systems.
• Assist technicians in resolving technical issues with analytical tools and processes.
• Occasionally handle chemicals while wearing appropriate personal protective equipment (PPE).
• Develop and refine analytical methods to enhance lab capabilities.
• Support fab manufacturing operations and participate in the team’s on-call schedule.
• Ensure adherence to lab safety protocols and cleanroom standards.

Minimum Qualifications/Requirements:

Education:

• Master’s degree in Chemistry, Physics, Material Science, Chemical Engineering, Electrical Engineering, or a related discipline.
• Minimum of 1 year of experience in a laboratory setting supporting Semiconductor R&D or High-Volume Manufacturing (HVM), with a focus on materials analysis techniques such as SIMS, XPS, or Auger Electron Spectroscopy.

Technical Skills:

• Strong knowledge and hands-on experience with at least one of the following lab techniques:
  • Secondary Ion Mass Spectrometry (SIMS)
  • X-Ray Photoelectron Spectroscopy (XPS)
  • Auger Electron Spectroscopy (AES)
• Minimum of 1 year of hands-on experience with at least one of the above techniques.
• Experience performing tool maintenance and preventive maintenance (PM) on lab equipment.
• Ability to troubleshoot and resolve technical issues with analytical tools and processes.
• Ability to work independently and prioritize tasks to meet deadlines.

Interpersonal Skills:

• Strong teamwork, positive attitude, and work ethic.
• Ability to handle pressure in a fast-paced environment and support lab operations outside of regular working hours.
• Willingness to work occasionally in a cleanroom environment.
• Proficiency in Microsoft Office Suite (Word, Excel, PowerPoint).
• Strong understanding of statistical analysis techniques, with the ability to apply statistical methods to analyze data, identify trends, and draw meaningful conclusions.
• Excellent written and verbal communication skills to effectively present findings and collaborate with teams.

Preferred Skills:

• Experience with sample preparation techniques, such as:
  • Cleaving or cutting samples to desired dimensions.
  • Deprocessing or delayering samples using polishing or chemical/RIE etching.
• Proficiency in advanced imaging techniques, including:
  • Scanning Electron Microscopy (SEM)
  • Transmission Electron Microscopy (TEM)
  • Focused Ion Beam (FIB)
• Familiarity with Energy Dispersive X-ray Spectroscopy (EDS) and/or Electron Energy Loss Spectroscopy (EELS) for material characterization.

Physical Requirements:

• Ability to work in a cleanroom or advanced manufacturing environment if needed.
• No additional physical requirements beyond common tasks such as extended walking, standing, or bending.

Training:

• On-the-job training will be provided to ensure familiarity with company-specific processes, systems, and quality standards.

Candidates must be willing and able to work on-site at our Phoenix, Arizona facility.