Array
(
[content] =>
[params] => Array
(
[0] => /forum/whats-new/latest-activity?before_id=96909
)
[addOns] => Array
(
[DL6/MLTP] => 13
[Hampel/TimeZoneDebug] => 1000070
[SV/ChangePostDate] => 2010200
[SemiWiki/Newsletter] => 1000010
[SemiWiki/WPMenu] => 1000010
[SemiWiki/XPressExtend] => 1000010
[ThemeHouse/XLink] => 1000970
[ThemeHouse/XPress] => 1010570
[XF] => 2030770
[XFI] => 1060170
)
[wordpress] => /var/www/html
)
You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today !
JavaScript is disabled. For a better experience, please enable JavaScript in your browser before proceeding.
You are using an out of date browser. It may not display this or other websites correctly.
You should upgrade or use an
alternative browser .
And Silver Lake probably secured an agreement with Intel allowing Altera to use non-Intel foundries after a certain period of time or...
Sep 30, 2025
X
3D DRAM does not require EUV:
AI Overview
No, 3D DRAM does not inherently require EUV lithography; in fact, the vertical stacking of...
Sep 30, 2025
X
Like chiplets and all those 3D packaging in IC world, 3D DRAM type is inevitable.
Sep 30, 2025
Dr Ian Cutress:
Whenever I talk about the land of compute, we imagine it as a line going from CPU to GPU, to FPGA then ASIC. If you...
Sep 30, 2025
F
The 4F2 vertical channel scheme is still continued scaling of bit line pitch (which increases its capacitance relative to capacitor) but...
Sep 30, 2025
TSMC's EUV Dynamic Power Saving: A Win-Win for Energy Efficiency and Production Capacity
Implementing Fab Automation is Projected to...
Sep 30, 2025
F
Main issue right now is they can't get enough layers (>100).
Sep 30, 2025
The dot-com boom (roughly 1995–2000) and the AI boom (2010s–present) are transformative periods driven by technological innovation, but...
Sep 30, 2025
(Reuters) -Citigroup (C) has raised its forecast for AI-related infrastructure spending by tech giants to surpass $2.8 trillion through...
Sep 30, 2025
F
3D DRAM does not require EUV:
AI Overview
No, 3D DRAM does not inherently require EUV lithography; in fact, the vertical stacking of...
Sep 30, 2025
F
DRAM really is in difficult situation. Some companies are planning 1d or 1e DRAM (but since their 1c is already in 11nm class...
Sep 30, 2025
F
There was the NUMMI at Fremont, CA. If 14A doesn't go well, we may see its semiconductor equivalent.
Sep 30, 2025
S
DRAM really is in difficult situation. Some companies are planning 1d or 1e DRAM (but since their 1c is already in 11nm class...
Sep 30, 2025
B
3D DRAM does not require EUV:
AI Overview
No, 3D DRAM does not inherently require EUV lithography; in fact, the vertical stacking of...
Sep 30, 2025
C
Always a good thing when people have to invent terms like "circular financing" to describe a business strategy, I feel like I've seen...
Sep 30, 2025