Array
(
[content] =>
[params] => Array
(
[0] => /forum/whats-new/latest-activity?before_id=91560
)
[addOns] => Array
(
[DL6/MLTP] => 13
[Hampel/TimeZoneDebug] => 1000070
[SV/ChangePostDate] => 2010200
[SemiWiki/Newsletter] => 1000010
[SemiWiki/WPMenu] => 1000010
[SemiWiki/XPressExtend] => 1000010
[ThemeHouse/XLink] => 1000970
[ThemeHouse/XPress] => 1010570
[XF] => 2021770
[XFI] => 1050270
)
[wordpress] => /var/www/html
)
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I
Indeed -- but how are they delivering compared to new AMD processors, not older Intel ones? ;-)
Aug 20, 2025
I
Actually that's not true, what's also pushing N forward is the need for lower power consumption per bit/operation as demand for...
Aug 20, 2025
S
This is a definitive win. The new Intel 3 server processors are delivering.
Aug 20, 2025
S
What’s New: Intel® Xeon® 6 processors with P-cores are now powering the new Amazon Elastic Compute Cloud (EC2) R8i and R8I-flex...
Aug 20, 2025
I
The problem for Intel is that it's increasingly difficult for any IDM to compete with TSMC as far as process/IP/PDCO is concerned -- not...
Aug 20, 2025
S
China has a lot of customers. SMIC's ecosystem isn't as large as TSMC's but there are plenty of clients with advanced designs...
Aug 20, 2025
C
Never say never. The reason I have confidence in this is the slowdown in the pace of Moore's law. If leading edge was still doubling...
Aug 20, 2025
S
The problem was at the chip level, where read latency was about 350ns, which poorly compares to DRAM. I think write latency was in the...
Aug 20, 2025
Could Mr. Pat Gelsinger invite Jensen Huang, Lisa Su, Tim Cook, and CC Wei, each separately, for a personal dinner? He could use the...
Aug 20, 2025
S
Over-sold by the team leadership, under performed compared to performance targets (latency was higher than projected), lack of...
Aug 20, 2025
T
Well, everyone is underestimating China...
No, not just China, there is a tendency to underestimate newcomers with momentum.
The same...
Aug 20, 2025
S
If we look back, Intel has missed many incredible opportunities over the years. I would argue that this is the inevitable result of...
Aug 20, 2025
I
"...delivering the highest performance and fastest memory bandwidth among comparable Intel processors in the cloud."
Note lack of...
Aug 20, 2025
No; the vertical order of layers in a packaged chip is as follows:
FSPD (conventional, die face down)
1. heatsink (top)
2. TIM
3. thick...
Aug 20, 2025
@IanD what happens to a BSPDN Chip for example an Intel 18A CPU running 6+ GHz do you think traditional cooling will be able to...
Aug 20, 2025
Like.
What’s New: Intel® Xeon® 6 processors with P-cores are now powering the new Amazon Elastic Compute Cloud (EC2) R8i and R8I-flex...
hist78 replied to the thread Opinion: To make IDM 3.0 a success, Intel must make other companies IDM.Could Mr. Pat Gelsinger invite Jensen Huang, Lisa Su, Tim Cook, and CC Wei, each separately, for a personal dinner? He could use the...
Daniel Nenni reacted to IanD's post in the thread How are the benefits of BSPD affected by 3D stacking? with