Array
(
[content] =>
[params] => Array
(
[0] => /forum/whats-new/latest-activity?before_id=91512
)
[addOns] => Array
(
[DL6/MLTP] => 13
[Hampel/TimeZoneDebug] => 1000070
[SV/ChangePostDate] => 2010200
[SemiWiki/Newsletter] => 1000010
[SemiWiki/WPMenu] => 1000010
[SemiWiki/XPressExtend] => 1000010
[ThemeHouse/XLink] => 1000970
[ThemeHouse/XPress] => 1010570
[XF] => 2021770
[XFI] => 1050270
)
[wordpress] => /var/www/html
)
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F
They're probably not that much worse than nanosheet devices, which are already worse then FinFETs for self-heating because they have...
Aug 20, 2025
Yeah I have worked in China and Japan and Japan also has a lot talent and are also very hard working.
Taiwan learned how to do...
Aug 20, 2025
IDM is not a good idea unless you cannot get support for the manufacturing required for your field. You need scale and the flexibility...
Aug 20, 2025
I
Which news is this, and in what mass media? A reliable source or one which just repeats/misunderstands stuff picked up somewhere else...
Aug 20, 2025
D
Exactly, go on the route that make TSMC difficult to compete in by having a deeper specialization into things.
And that is true when...
Aug 20, 2025
D
Everyone is making same chips: DSP array, SRAM, DDR/HBM phy and some fast IO. Sometimes it looks like just different SKU's of same...
Aug 20, 2025
J
Everyone is making same chips: DSP array, SRAM, DDR/HBM phy and some fast IO. Sometimes it looks like just different SKU's of same...
Aug 20, 2025
T
I accept
And It's not that IDM can't do open innovation.
Personally, I think it would be better if it just evolved into a new form of...
Aug 20, 2025
D
We aimed to create an IDM in a new era with the flexibility of being able to create chips like Foundry, like Foundry.
While maintaining...
Aug 20, 2025
C
Yes, I agree
But I didn't mean to say that
I wanted to emphasize that no matter how small the scale, we should not underestimate...
Aug 20, 2025
T
I do believe what you said is partially correct. But there are points that you have likely missed out on.
I think that IDM has its...
Aug 20, 2025
T
Yes, I agree
But I didn't mean to say that
I wanted to emphasize that no matter how small the scale, we should not underestimate...
Aug 20, 2025
I
No; the vertical order of layers in a packaged chip is as follows:
FSPD (conventional, die face down)
1. heatsink (top)
2. TIM
3. thick...
Aug 20, 2025
If you say IBM 2.0, there is no future LOL
😆😆😆
Absolutely
Aug 20, 2025
D
I do believe what you said is partially correct. But there are points that you have likely missed out on.
I think that IDM has its...
Aug 20, 2025
Like.
They're probably not that much worse than nanosheet devices, which are already worse then FinFETs for self-heating because they have...
Daniel Nenni reacted to count's post in the thread Opinion: To make IDM 3.0 a success, Intel must make other companies IDM with
hist78 reacted to tomatoma's post in the thread Opinion: To make IDM 3.0 a success, Intel must make other companies IDM with