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Are you asking about die-to-die stacking (face-to-face, face-to-back), chiplets in vertical integration, or high-bandwidth memory (HMB)...
Aug 15, 2025
Are you asking about die-to-die stacking (face-to-face, face-to-back), chiplets in vertical integration, or high-bandwidth memory (HMB)...
Aug 15, 2025
X
Do the overall "performance" benefits from Backside Power Delivery decrease (or increase?) when moving from single height ("2D")...
Aug 15, 2025
P
But this proves the point of them being very "linear". They built a purpose made military computer with an explicit set of tasks in...
Aug 15, 2025
S
His path was also poison pilled by Swan previously negotiating N3 capacity. That reduced the amount of Intel products that could ever go...
Aug 15, 2025
S
Isnt this how an export tariff works?
Aug 15, 2025
S
Nvidia and AMD have agreed to give the US government 15 per cent of their revenues from chip sales in China, under an arrangement to...
Aug 15, 2025
S
I don't think age has anything to do with it. Craig was and perhaps still is a brilliant materials scientist, I suspect he was in the...
Aug 15, 2025
S
Perhaps we shouldn't listen to Barrett because he's infamous for not listening to others? Below quote per Bob Colwell, who was part of...
Aug 15, 2025
S
"Craig Barrett served as CEO of Intel from 1998 to 2005 and as Chairman from 2005 to 2009. He was not only the captain steering the...
Aug 15, 2025
S
Abandoning FAB will not restore performance
Because there are no good products in Intel at the moment
The idea that just throwing away...
Aug 15, 2025
S
Any CEO’s decisions, strategies, and vision can greatly impact a company’s future long after his or her retirement. They can determine...
Aug 15, 2025
S
A couple of teasers from the article:
"6. The current Intel CEO's comments about not investing in new technology (14A) until customers...
Aug 15, 2025
X
Intel's financial situation won't allow Pat Gelsinger to be the Intel CEO for two more years. Intel has been in negative Free Cash Flow...
Aug 15, 2025
S
Yeah same but that problem has been solved with clustered decoding not to mention Intel APX as an extension finally matching ARM in...
Aug 15, 2025
Like.
Are you asking about die-to-die stacking (face-to-face, face-to-back), chiplets in vertical integration, or high-bandwidth memory (HMB)...
Daniel Nenni replied to the thread How are the benefits of BSPD affected by 3D stacking?.Are you asking about die-to-die stacking (face-to-face, face-to-back), chiplets in vertical integration, or high-bandwidth memory (HMB)...