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Corporate weaknesses often start out as strengths. Once upon a time, Intel's radical Copy Exact! culture made it possible to produce at...
Aug 14, 2025
X
well Lunar Lake is such a design but the core part lacks in comparison to apple
Here are the battery lifef and idle power consumption
Aug 14, 2025
It is a cultural thing for Samsung. They must be first no matter what the yield is. Unfortunately in the foundry business being first...
Aug 14, 2025
M
Corporate weaknesses often start out as strengths. Once upon a time, Intel's radical Copy Exact! culture made it possible to produce at...
Aug 14, 2025
M
This report is a detailed summary. I was working with the Xscale teams on all of those products and with TD on all the processes. I can...
Aug 14, 2025
Yield, Yield, Yield!
How many good things and bad things are because of you?
Aug 14, 2025
The first iPhone was released in June 2007, and by 2012 it had enjoyed several years of explosive growth. In this 2012 interview...
Aug 14, 2025
I remember Paul telling a story about an Intel internal discussion about the iPhone. An unnamed executive said it was a joke. Phones...
Aug 14, 2025
The first iPhone was released in June 2007, and by 2012 it had enjoyed several years of explosive growth. In this 2012 interview...
Aug 14, 2025
K
I remember Paul telling a story about an Intel internal discussion about the iPhone. An unnamed executive said it was a joke. Phones...
Aug 14, 2025
I remember Paul telling a story about an Intel internal discussion about the iPhone. An unnamed executive said it was a joke. Phones...
Aug 14, 2025
Paul Otellini and Intel didn’t ignore the mobile opportunity. The problem was that he and Intel insisted on embracing mobile the Intel...
Aug 14, 2025
He will be known as the man who missed mobile!
https://semiwiki.com/wikis/industry-wikis/paul-otellini-wiki/
Aug 14, 2025
B
Corporate weaknesses often start out as strengths. Once upon a time, Intel's radical Copy Exact! culture made it possible to produce at...
Aug 14, 2025
K
Per wikipedia, The Rubin chips will be manufactured by TSMC using a 3 nm process and will use HBM4 memory. It is scheduled for mass...
Aug 14, 2025