I heard Intel say it makes gross margin lower for lunar lake. but in general, I would think EMS/ODMS/OEMs would be happy to not have to buy DRAM and support the MB cost of DRAM support.
Any advanced packaging technology will be an added cost. If Intel can use its buying power to integrate cheaper (compared to what OEMs pay) memory into Lunar Lake products and create more room for OEM customers such as HP, Dell, Lenovo, Asus, Acer, etc., to make more profit, those customers will buy Lunar Lake products. Why not! They are already in a market (in terms of specs, technology, protocols, standards, etc.) that is tightly controlled by Intel. If Intel’s Lunar Lake can bring more profit margin to them, they will buy. Especially considering their thin net profit margins (hovering around 2% to 5%), any help is welcome.
The problem is: can Intel do that? Further, are notebook PCs the right target for such an advanced packaging arrangement?
1. Intel’s manufacturing efficiency and cost structure may make Lunar Lake less attractive to consider. The OEMs’ slim net profit margins do not have room for it. Intel’s advanced packaging may be great in performance, but it may not be a good fit for such a low margin PC market.
2. Intel is an IDM. Intel needs to pay for and acquire the Lunar Lake memory in advance, then go through the lengthy packaging, testing, and sales/distribution/supply chain/accounts receivable process. With Intel’s current financial stress, it’s an expensive journey.
TSMC follows the foundry/fabless business model. Apple, Qualcomm, Nvidia, AMD, and Broadcom choose the right product to use a particular TSMC advanced packaging technology for the right target market. In that process, all the memory is acquired by the customers, and TSMC pays nothing. Those expensive memory components are owned by the customers and are not counted as TSMC’s inventory. The financial implications between TSMC and Intel are totally different.