According to a report from South Korean media outlet *Maeil Business Newspaper*, U.S. semiconductor company Intel (INTC-US) has sought to establish a "foundry alliance" with Samsung Electronics, laying the groundwork to catch up with TSMC (2330-TW)(TSM-US).
Citing sources from the semiconductor industry, the report stated that senior Intel officials recently requested to meet with Samsung's top executives, conveying CEO Pat Gelsinger's desire to personally meet Samsung Electronics Chairman Lee Jae-yong to discuss "comprehensive cooperation measures in the foundry sector."
Since the establishment of Intel Foundry Services (IFS) in 2021, Intel has signed contracts with Cisco and AWS but has not attracted major clients relative to its investment. Samsung Electronics established its foundry division in 2017 and began attracting customers, but it still lags significantly behind TSMC.
According to TrendForce, TSMC held a 62.3% share of the foundry market in the second quarter, while Samsung Electronics had 11.5%. Notably, TSMC controls 92% of the market share in advanced process technologies such as 3nm and 5nm.
The report suggests that if the "foundry alliance" between Intel and Samsung is realized, it could lead to comprehensive cooperation in areas like process technology exchange, production facility sharing, and research and development.
Samsung Electronics has a technology called "3nm GAA" that can enhance performance and power efficiency in advanced processes, while Intel has technologies such as Foveros, which can combine chips made from different processes into a single package, and PowerVia, which can improve power efficiency. These technologies could be collaboratively developed for AI, data centers, and mobile application processors (AP), where high performance and low power consumption are crucial.
Moreover, Samsung Electronics has manufacturing plants in the U.S., South Korea, and China, while Intel has plants in the U.S., Ireland, and Israel, meaning they could potentially share facilities or win orders together if necessary. Especially with increasing U.S. and EU control over high-tech semiconductor exports, regional production may be required.
Kim Hyung-joon, head of next-generation smart semiconductor business (and a former professor of materials engineering at Seoul National University), stated that if the foundry alliance between Intel and Samsung Electronics is established, the synergy potential is limitless. However, given TSMC's dominant position, it would be difficult to expect immediate major impacts.
Both Samsung Electronics and Intel stated that they "cannot confirm" whether high-level meetings will take place.
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Citing sources from the semiconductor industry, the report stated that senior Intel officials recently requested to meet with Samsung's top executives, conveying CEO Pat Gelsinger's desire to personally meet Samsung Electronics Chairman Lee Jae-yong to discuss "comprehensive cooperation measures in the foundry sector."
Since the establishment of Intel Foundry Services (IFS) in 2021, Intel has signed contracts with Cisco and AWS but has not attracted major clients relative to its investment. Samsung Electronics established its foundry division in 2017 and began attracting customers, but it still lags significantly behind TSMC.
According to TrendForce, TSMC held a 62.3% share of the foundry market in the second quarter, while Samsung Electronics had 11.5%. Notably, TSMC controls 92% of the market share in advanced process technologies such as 3nm and 5nm.
The report suggests that if the "foundry alliance" between Intel and Samsung is realized, it could lead to comprehensive cooperation in areas like process technology exchange, production facility sharing, and research and development.
Samsung Electronics has a technology called "3nm GAA" that can enhance performance and power efficiency in advanced processes, while Intel has technologies such as Foveros, which can combine chips made from different processes into a single package, and PowerVia, which can improve power efficiency. These technologies could be collaboratively developed for AI, data centers, and mobile application processors (AP), where high performance and low power consumption are crucial.
Moreover, Samsung Electronics has manufacturing plants in the U.S., South Korea, and China, while Intel has plants in the U.S., Ireland, and Israel, meaning they could potentially share facilities or win orders together if necessary. Especially with increasing U.S. and EU control over high-tech semiconductor exports, regional production may be required.
Kim Hyung-joon, head of next-generation smart semiconductor business (and a former professor of materials engineering at Seoul National University), stated that if the foundry alliance between Intel and Samsung Electronics is established, the synergy potential is limitless. However, given TSMC's dominant position, it would be difficult to expect immediate major impacts.
Both Samsung Electronics and Intel stated that they "cannot confirm" whether high-level meetings will take place.

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