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Intel 14A risk production in 2028, HVM in 2029: Lip-Bu Tan at CISCO AI Summit 3 Feb 2026

user nl

Well-known member
Nice to see LBT speak about IF at CISCO AI summit yesterday, he starts around 48 minutes:


It seems no more uncertainty about 14A, it will ramp.......
 
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So they said Risk Production was 2027 in the IFS Connect 2025 now it's 2028 are they moving timelines?
That's what LBT says at 51:40

LBT clearly has two major concerns regarding 14A, the variability of the yield and the IP availability. It seems they simply need more time to get that in a better shape. He only wants 5 or 10% of a major product of early customers for 14A to commit to that so that he can get the trust of those companies.

So perhaps Apple, NVIDIA, Microsoft will commit to some small wafer orders to be manufactured in 2029........He will not give the names of the intended customers that he hopes will sign purchase agreements in H2-2026.

I think this may be quite smart (humble) timing of INTEL, these customers have their main orders with TSMC being made in 2028, they trust that that will come. And then INTEL will deliver some small overflow capacity in 2029 of say 5-10%. In that way these customers do not risk major parts of their production if INTEL fails. Makes sense for both sides.

Will be interesting to see if TSMC now goes full in on A14, scheduled for HVM in 2028? They have started building the new fab for A14:
https://en.eeworld.com.cn/news/manufacture/eic712929.html#:~:text=Furthermore, TSMC notified its customers,platform officially put into operation.

1770204937960.png
 
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I think this may be quite smart (humble) timing of INTEL, these customers have their main orders with TSMC being made in 2028, they trust that that will come. And then INTEL will deliver some small overflow capacity in 2029 of say 5-10%. In that way these customers do not risk major parts of their production if INTEL fails. Makes sense for both sides.
problem is small volume won't justify 14A it needs big volume also i think that 28 risk production is for external and 27 for Internal
 
That's what LBT says at 51:40

LBT clearly has two major concerns regarding 14A, the variability of the yield and the IP availability. It seems they simply need more time to get that in a better shape. He only wants 5 or 10% of a major product of early customers for 14A to commit to that so that he can get the trust of those companies.

So perhaps Apple, NVIDIA, Microsoft will commit to some small wafer orders to be manufactured in 2029........He will not give the names of the intended customers that he hopes will sign purchase agreements in H2-2026.

I think this may be quite smart (humble) timing of INTEL, these customers have their main orders with TSMC being made in 2028, they trust that that will come. And then INTEL will deliver some small overflow capacity in 2029 of say 5-10%. In that way these customers do not risk major parts of their production if INTEL fails. Make sense for boith sides.

Will be interesting to see if TSMC now goes full in on A14, scheduled for HVM in 2028? They have started building the new fab for A14:
https://en.eeworld.com.cn/news/manufacture/eic712929.html#:~:text=Furthermore, TSMC notified its customers,platform officially put into operation.

View attachment 4141
I hate the way they always pick a comparison that makes something look artificially good -- why isn't the comparison A14 vs. N2P, which is the real alternative?

(which claims 5% more speed and 10% lower power than N2, meaning A14 would presumably give 5~10% more speed and 10~20% lower power, rather less attractive...)
 
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