The lion share of all chips will never use FINFET nodes for near zero benefit for low speed, small die size, utilitarian ICs.
WIthout automation ... perhaps.
With automation... disagree.
28nm leaks like crazy
22fdsoi... probably not much cheaper than finFETs.
16-12 has routable contacts. Saves 2 pitches stdcells, 2 extra layers (2x).
We are 100% bought into these DUV finFET processes... and we automated them. 16-12nm + interposers will be the sweet spot. We are betting on it.
EDIT: I should add that I am talking about TSMC and GF. I have never used an Intel process.
Last edited: