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Well Intel 16 can be based on 22nm and 12nm can be based on 14nm and the differences between Intel 14nm and 22nm is substantial.
This is just guesswork on my part though.
Well Intel 16 can be based on 22nm and 12nm can be based on 14nm and the differences between Intel 14nm and 22nm is substantial.
This is just guesswork on my part though.
I've read that 12nm was supposed to be comparable to TSMC's 12nm, and I assumed the '16' in Intel 16 nm likewise was supposed to compare to TSMC's 16nm.
I've read that 12nm was supposed to be comparable to TSMC's 12nm, and I assumed the '16' in Intel 16 nm likewise was supposed to compare to TSMC's 16nm.
The 14 nanometer (14 nm) lithography process is a semiconductor manufacturing process node serving as shrink from the 22 nm process. The term '14 nm' is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch.
en.wikichip.org
you can search wikichip for rest of the details
For TSMC 12nm vs Intel 14nm
and if we take wikipedia and wikichip as reference 14nm is better than tsmc 12nm
Just that alone means that this will not be reaching the level of $1 MCUs, which is a gigantic market. 1000+ dies per wafer ICs are already too small to comfortably fit contact pads for cheaper packaging methods, but too cheap for substrates, and panel based packaging. And they are already shipping in giant volumes while using relatively small wafer order quantities.
The 14 nanometer (14 nm) lithography process is a semiconductor manufacturing process node serving as shrink from the 22 nm process. The term '14 nm' is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch.
Intel/UMC 12nm is most likely the same level as 14nm(rebranding 14nm as 12nm) that's just my expectations but yes it should be substantially different from Intel 16. The PDK is not out yet so i can't comment what's the spec ut's just my estimate based on the public info.
Intel/UMC 12nm is most likely the same level as 14nm(rebranding 14nm as 12nm) that's just my expectations but yes it should be substantially different from Intel 16. The PDK is not out yet so i can't comment what's the spec ut's just my estimate based on the public info.
Really wonder if UMC can attract any customers to this node. Intel's future might be riding on it. Remember, Intel says they only need mid-single digit billions of external revenue to break even for foundry.
Just that alone means that this will not be reaching the level of $1 MCUs, which is a gigantic market. 1000+ dies per wafer ICs are already too small to comfortably fit contact pads for cheaper packaging methods, but too cheap for substrates, and panel based packaging. And they are already shipping in giant volumes while using relatively small wafer order quantities.
Not my bag. I am commenting on the other kind of 16-12nm customer. Custom ASICs to replace FPGAs, increase performance, decrease power. Your comment referred to the commodity market. Got it.
en.wikichip.org
