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(Exclusive) Intel’s Annual Conference Moves to Arizona for the First Time – A Three-Pronged Analysis of Lip-Bu Tan's Reform Path

XYang2023

Well-known member
Intel's reform path has attracted much attention, and its annual conference has moved to Phoenix, Arizona, the United States for the first time. Photo by Li Jianliang
Intel's reform path has attracted much attention, and its annual conference has moved to Phoenix, Arizona, the United States for the first time. Photo by Li Jianliang

After Intel's new CEO Lip-Mo Chen took office, every move of his reforms has attracted the attention of the industry. According to the supply chain, Intel's annual conference in September will be moved to Phoenix, Arizona, for the first time. Before that, there are three aspects worth paying attention to.

The internal rectification of the road of drastic reforms ended in July 

Chip industry insiders revealed that Intel has never stopped layoffs and retirements since Pat Gelsinger returned in 2021. After Lip-wu Chen took over as CEO in March 2025, he launched a restructuring plan, the latest wave of which was a 20% cut in staff.

This includes the wafer manufacturing department. However, the industry estimates that the internal reorganization is expected to be completed by the end of July, and there will be no drastic organizational changes until 2026.

Since taking office, Chen Liwu has made drastic changes to the company's structure, and there have been personnel changes every month for more than four months.

Not only did many senior executives resign, but layoffs also covered all departments and regions. The latest wave of layoffs was rare, mainly in the wafer manufacturing department, with a reduction of about 20%. For example, the Israeli plant has a total of about 1,000 employees leaving.

The supply chain said that Intel's design department reorganized three major departments to report directly to Lip-Mou Chen, including the promotion of Sachin Katti, head of network chips, to chief technology officer and head of the AI department, as well as the Client Computing Group (CCG) PC department and the Data Center Group (DCG) data center department. It is hoped that the flattening of the organization will further improve efficiency and quickly understand the current market situation.

Currently, understanding customer needs is Intel's top priority. It has also readjusted its product technology direction, emphasizing a “software”-led design approach to rebuild the trust of ecosystem partners and strengthen relationships.

Many of Intel's former employees quickly moved to major companies such as TSMC, NVIDIA, AMD and Samsung Electronics, while some Taiwanese employees went to work in supply chains such as ASUS and Gigabyte.

The annual conference moved to Phoenix and attracted much attention in collaboration with TSMC eSports

Intel will hold the "Intel Technology Tour" in Phoenix, Arizona at the end of September. This move also declares its determination to make a comeback. Chen Liwu will further explain the technologies such as 18A, 14A advanced processes and advanced packaging, as well as the progress of customer wafer production.

The outside world is currently mostly conservative about Intel's prospects, and there are constant reports that Intel will abandon external outsourcing of the 18A process and shift its focus to 14A. At the same time, the willingness of American customers who had previously announced their investment has also been greatly reduced.

However, it is reported that after Intel completed layoffs at the end of July, in addition to publicly disclosing its advanced wafer fab locations and process technology at the end of September, it will also release the latest PC and data center platform processors.

Among them, Panther Lake processors will be mass-produced in the H series in the fourth quarter. In addition, Nova Lake-S/HX/H processors will be launched quarter by quarter starting from the fourth quarter of 2026 at the earliest. The in-depth cooperation with TSMC in the 2nm process has attracted much attention.

Intel's strategic direction changes dramatically, and Taiwan's equipment supply chain welcomes it

Previously, the annual "Intel Technology Tour" conference was held in Penang, Malaysia and Taipei in 2023 and 2024, respectively.

It is worth mentioning that after the Intel conference, SEMICON West 2025 will also move to Phoenix for the first time a week later from October 7 to 9. Industry insiders interpret that this highlights the rapid increase in the importance of Arizona in the global semiconductor landscape.

It is understood that with the support of the Arizona state government and others, more than 100 semiconductor companies such as Intel, TSMC, and Amkor have moved in. As the global semiconductor market moves towards a scale of 1 trillion US dollars, it is expected to become a key stronghold for industry innovation and growth.

Intel's strategic shift has also brought new business opportunities to Taiwan's semiconductor equipment supply chain.

Semiconductor equipment manufacturers confirmed that Intel has significantly changed its strategy in equipment procurement over the past year or so. It no longer insists on cooperating with European, American and Japanese manufacturers for many years, and has also loosened the certification time and procedures, starting to lock in TSMC's long-established Taiwanese supply chain. Many equipment manufacturers have received orders from Intel or have been certified under Intel's support.

Equipment manufacturers admit that if the supply is from Taiwan, Intel's order gross profit margin is actually better than TSMC's.

Compared to Intel's previous hope that Taiwanese companies could set up factories in the United States or send personnel to provide on-site support, the estimated costs were not cost-effective, so Taiwanese companies were originally conservative.

With the Arizona state government providing subsidies and vigorously promoting it, as well as TSMC's expansion of its wafer fabs and advanced packaging plants, and the interference of chip tariffs, Taiwan's supply chain's willingness to set up factories in the United States has indeed shown a more obvious positive turn in recent times.

 
Some points from the article:

Intel to finish restructuring by July, no major changes through 2026.
In Sept, it will showcase 18A/14A, advanced packaging & customer tape-outs at its Tech Tour.
New PC & data center chips to be unveiled.
Intel shifts procurement strategy, tapping TSMC-aligned Taiwan suppliers.
 
Interesting that Intel is starting to procure from the same high-volume vendors in Taiwan that TSMC uses.

Intel pays billions more than TSMC for the same stuff, this is a necessary measure to break the discriminatory pricing policy of US vendors on US fabs. Don't get me started on this.
 
Interesting that Intel is starting to procure from the same high-volume vendors in Taiwan that TSMC uses.

Intel pays billions more than TSMC for the same stuff, this is a necessary measure to break the discriminatory pricing policy of US vendors on US fabs. Don't get me started on this.
Pricing depends on customer. This is a foundational principle when Intel and TSMC sell to clients. Also Intel terms for suppliers are not the same as TSMC.... maybe LBT will fix that too.
 
what do you mean by this? does intel pay more for the same stuff?
I believe @benb was referring to that. But all suppliers have different pricing for tools, products, services by large customer.
I would guess Intel was getting best price until 2019 .... the TSMC is getting best pricing (maybe best tools also).
ASML/AMAT pricing for TSMC and Intel (and Samsung and Micron are different (and they should be)

There are contract terms to use to monitor and control this if you are the customer. All part of "deal making"
 
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