Most people know TSMC as the powerhouse that fabricates the world’s most advanced silicon chips—but what happens next is just as critical.
Here’s a quick breakdown of the journey a chip takes after fabrication:
1. Wafer Sort (E-Test):
Each wafer undergoes probe testing using Automated Test Equipment (ATE) to verify electrical functionality at the die level. Known Good Dies (KGDs) are identified using pre-defined test patterns and parametric specs. These test patterns are generated during pre-silicon stage using different Design-for-Test methodologies.2. Dicing:
The wafer is then cut into individual chips (dies) using a diamond saw or laser. Precision is key—one slip and high-value dies can be lost. Protective coatings like UV tape are applied beforehand to avoid chipping or contamination.3. Die Attach & Packaging:
Good dies are mounted onto a package substrate. Interconnection is achieved via wire bonding, flip-chip bumping, or Through-Silicon Vias (TSVs), depending on the package type (e.g., FC-BGA, 2.5D, 3DIC).4. Package-Level Testing (Final Test):
Packaged parts undergo functional, parametric, and reliability testing. This includes power-on tests, scan chain validation, and timing characterization. This catches any damage that may have occurred during packaging.5. Burn-In & Reliability Screening (as needed):
To screen for early-life failures (infant mortality), parts may be subjected to HTOL (High Temperature Operating Life) or HAST (Highly Accelerated Stress Test), especially for mission-critical or automotive-grade components.6. Marking & Serialization:
Each packaged chip is laser-marked or labeled with traceable identifiers including lot, wafer ID, die position, and unique part numbers.7. Tape & Reel / Tray Packing:
Devices are packed into JEDEC-standard trays or tape-and-reel formats, which are ready for pick-and-place machines in final system assembly.8. Logistics & Shipment:
Finally, the chips are shipped to OEMs or system integrators (like Apple, NVIDIA, AMD) where they’re assembled into consumer devices, data centers, and more.It’s a long journey from wafer to widget—and every step matters.
Next time you’re holding your smartphone or powering up your laptop, remember: that tiny chip inside took a global, high-precision journey to get there!
