Google Cloud’s VP Rehan Sheikh unveiled a next-gen TPU spec that literally put “Diamond on Chip” on the slide — a radical cooling idea no engineer I spoke to had ever seen before. With TSMC’s CoWoS capacity shifting away from Nvidia, Google may soon ship more TPUs than Huang’s GPUs for the first time.
Meanwhile, GlobalWafers’ Doris Hsu warned of a coming “Critical Materials Battle” that could reshape the entire semiconductor supply chain, from gallium to low-CTE glass fiber cloth.
And then there’s Nvidia’s stumble: Blackwell GB200 GPUs rolling off the line but sitting idle, waiting for the billion-dollar NVL72 racks that didn’t ship on time.
Three key signals from SEMICON Taiwan that highlight where the semiconductor industry is headed in 2026.
cwnewsroom.substack.com
Meanwhile, GlobalWafers’ Doris Hsu warned of a coming “Critical Materials Battle” that could reshape the entire semiconductor supply chain, from gallium to low-CTE glass fiber cloth.
And then there’s Nvidia’s stumble: Blackwell GB200 GPUs rolling off the line but sitting idle, waiting for the billion-dollar NVL72 racks that didn’t ship on time.
Three key signals from SEMICON Taiwan that highlight where the semiconductor industry is headed in 2026.
SEMICON Taiwan 2025: Diamond on Chip, Google’s TPU vs. Nvidia, and Critical Materials Battle
Liang-rong Chen
cwnewsroom.substack.com