The Chinese semiconductor industry's commitment to and pursuit of HBM (High Bandwidth Memory) development is strong. Yangtze Memory Technology (YMTC), a major local NAND manufacturer, is also reportedly conducting research and development on DRAM and seeking collaborations with major local DRAM manufacturers.
According to industry sources on the 1st, YMTC plans to invest in DRAM research and development facilities as early as the end of this year.
YMTC, headquartered in Wuhan, China, is the largest local NAND manufacturer. While it has yet to commercialize a DRAM product, it is known to be continuously developing related technologies.
YMTC is particularly interested in HBM. HBM is a memory technology that vertically stacks multiple DRAMs to enhance data processing performance and is considered an essential component of AI data centers.
A semiconductor industry insider said, "YMTC is discussing a plan to order DRAM R&D equipment for HBM from some of its partners," adding, "It is expected to be finalized as early as the end of this year."
YMTC's development of HBM-based DRAM isn't simply the product of an individual company's efforts. It's understood that YMTC is currently collaborating with another local semiconductor company, Changxin Memory Technology (CXMT), on HBM development. CXMT, China's largest DRAM manufacturer, has successfully mass-produced HBM2 (third-generation HBM).
“I understand that YMTC is collaborating with CXMT on the development of DRAM and HBM,” Choi Jeong-dong, senior vice president of semiconductor research firm TechInsights, told ZDNet Korea. “In particular, a plan is being attempted in which CXMT will provide DRAM and YMTC will supply hybrid bonding technology, which is likely to be applied to next-generation HBM.”
Hybrid bonding is a technology that directly bonds the copper wires of each chip. By eliminating the bumps required for conventional chip connections, it reduces HBM package thickness and improves performance and heat dissipation.
zdnet.co.kr
According to industry sources on the 1st, YMTC plans to invest in DRAM research and development facilities as early as the end of this year.
YMTC, headquartered in Wuhan, China, is the largest local NAND manufacturer. While it has yet to commercialize a DRAM product, it is known to be continuously developing related technologies.
YMTC is particularly interested in HBM. HBM is a memory technology that vertically stacks multiple DRAMs to enhance data processing performance and is considered an essential component of AI data centers.
A semiconductor industry insider said, "YMTC is discussing a plan to order DRAM R&D equipment for HBM from some of its partners," adding, "It is expected to be finalized as early as the end of this year."
YMTC's development of HBM-based DRAM isn't simply the product of an individual company's efforts. It's understood that YMTC is currently collaborating with another local semiconductor company, Changxin Memory Technology (CXMT), on HBM development. CXMT, China's largest DRAM manufacturer, has successfully mass-produced HBM2 (third-generation HBM).
“I understand that YMTC is collaborating with CXMT on the development of DRAM and HBM,” Choi Jeong-dong, senior vice president of semiconductor research firm TechInsights, told ZDNet Korea. “In particular, a plan is being attempted in which CXMT will provide DRAM and YMTC will supply hybrid bonding technology, which is likely to be applied to next-generation HBM.”
Hybrid bonding is a technology that directly bonds the copper wires of each chip. By eliminating the bumps required for conventional chip connections, it reduces HBM package thickness and improves performance and heat dissipation.
中 낸드 기업도 D램·HBM 시장 넘본다…기술력 좌시 못해
중국 반도체 업계의 HBM(고대역폭메모리) 개발 의지와 추격이 거세다. 현지 주요 낸드 업체인 양쯔메모리테크놀로지(YMTC)도 D램에 대한 연구개발은 물론, 현지 주요 D램 제조업체와의 협력을 도모하고 있는 것으로 알려졌다.1일 업계에 따르면 YMTC는 이르면 올 연말 D램 연구개발용 설비...