You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please, join our community today!
"The US has been trying to restrict China from developing high-end chip production capabilities, while seeking to avoid disrupting its production of commodity chips."
https://www.silicon.co.uk/e-regulation/us-china-japan-chip-memory-591866
Reportedly, CXMT was recently excluded from the...
China Changxin Storage's DDR5 yield rate has reached 80%, and it is also striving to produce HBM2 in small quantities by 2025 (Auto-translation)
Written by Atkinson | Release date: 2025-01-03 9:30 |
Foreign media reported that China's third-party memory module manufacturers began to sell DDR5...
That would be impossible to happen:
https://www.tomshardware.com/tech-industry/tsmc-cannot-produce-2nm-chips-overseas-until-domestic-output-becomes-more-advanced-confirms-taiwanese-govt-official
Taiwanese regulations require domestic chipmakers to manufacture only chips using...
Published 26 mins ago on December 26, 2024
By James Lee Taylor
South Korea considering forming KSMC to challenge TSMC with Samsung expertise. The name of this organization, Korea Semiconductor Manufacturing Company, is purely inspired by the Taiwanese Semiconductor Manufacturing Company (TSMC)...
Two months ago, he did acknowledge they could have the means to do even 3nm: https://wccftech.com/asml-ceo-believes-that-china-might-be-able-to-produce-chips-on-the-5nm-and-3nm-nodes-on-a-limited-scale/
Of course, whether they are actually there is a different story, though Xiaomi is reported...
Assuming Broadcom was a customer, it would have received PDK 1.0: https://hwbusters.com/news/intels-18a-faces-challenges-with-broadcom-while-20a-plans-for-arrow-lake-are-canceled-for-foundry-customers/
So PM's comment suggests they got the bad results with an older PDK.
Two statements from Naga give reason to be wary:
1. "And 18A, our biggest customer for the next two, three years is still Intel products,"
2. "Now it is about going through the remaining yield challenges, defect density challenges, continuing to improve it, improving process margin and getting...
I just read Naga Chandrasekaran saying that 18A still had defect density challenges and milestones to achieve. https://seekingalpha.com/article/4742201-intel-corporation-intc-ubs-global-technology-and-ai-conference-transcript
No high-NA because there is stitching.
Moreover, the EUV community knows (but doesn't like to announce widely) that high-NA requires a different EUV mask substrate than the 0.33NA.
Intel 18A has two sets of interconnects (backside and frontside) which have to be separately aligned and patterned. TSMC A16 would be the same.
https://www.anandtech.com/show/18894/intel-details-powervia-tech-backside-power-on-schedule-for-2024
郭明錤 (Ming-Chi Kuo) Nov 5, 2024
Intel has recently announced that after Lunar Lake (LNL), it will discontinue integrating DRAM into CPU packaging. While this news has caught public attention recently, people working in the PC industry have known for at least six months — according to Intel’s...
