TSMC, in an effort to boost the consumer demand for its 3nm process, is planning to launch a Continu[...]
As part of a Continuous Improvement Plan (CIP), TSMC will target reducing EUV machine use. From 25 EUV layers for 3nm down to 20, for example. Tool cost is one issue. Another is the heavy utility consumption (electric power, water), which is actually another specific type of cost.