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Panther Lake design rules revealed, no HD cells

I would like to point out few things
  • - Intel has traditionally used HP Cells in their Products. Intel 10nm -> ADL,RPL,TGL Intel 4/3 -> MTL/ARL.​
  • - The decision to use HP/HD is on design not on foundry for what characteristics they want.​
  • As for whether Intel can do 32nm direct print or not remains to be seen cause they didn't put it in any other product yet.​
  • The article seems poorly written imo.​
 
Given the power consumption and performance of PTL, I say they made a good design choice.

For customers, doesn't that mean they have a potentially chaper alternative (since it is less dense) for the same power/performance level?
 
1771683089169.png
 
If Backside or GAA/RibbonFET are new sources of yield loss, then relaxing to 36 nm pitch looks understandable. That said, high defect density at 36 nm pitch has been noted publicly before by imec, Samsung, and even (indirectly) TSMC.
 
Feels like the last point is nonsense the decision to use HP/HD lies solely on the product group and their needs
I think the article want to point out that even under HP cell the yield is still not high, so the HD cell with smaller pitch may get worse.

It is interesting to see when we will find 18A HD cell? Maybe Nova Lake?
 
I think the article want to point out that even under HP cell the yield is still not high, so the HD cell with smaller pitch may get worse.

It is interesting to see when we will find 18A HD cell? Maybe Nova Lake?
Well NVL is mix of 18AP/N2for compute tiles
If Backside or GAA/RibbonFET are new sources of yield loss, then relaxing to 36 nm pitch looks understandable. That said, high defect density at 36 nm pitch has been noted publicly before by imec, Samsung, and even (indirectly) TSMC.
I remember the issue being parametric not the D0 the D0 has been decent from what i know
 
I think the article want to point out that even under HP cell the yield is still not high, so the HD cell with smaller pitch may get worse.

It is interesting to see when we will find 18A HD cell? Maybe Nova Lake?
Future Intel iGPUs, NPU (AI) type dies are possible candidates for 18A HD as they don't need to aim for maximum clock rates.
 
Looks like Jukan has access to a teardown, but doesn't provide the TEMs. Show us the TEMs Jukan. This is one of the first GAA products on the market, just showing it should be fascinating. Can we set aside politics long enough to take a breath and just enjoy the achievement of a GAAFET, a new milestone in semiconductors?
 
Looks like Jukan has access to a teardown, but doesn't provide the TEMs. Show us the TEMs Jukan. This is one of the first GAA products on the market, just showing it should be fascinating. Can we set aside politics long enough to take a breath and just enjoy the achievement of a GAAFET, a new milestone in semiconductors?
XD

Samsung is crying.

First GAA product is SF3, including MicroBT, W1000 watch and Exynos 2500
 
XD

Samsung is crying.

First GAA product is SF3, including MicroBT, W1000 watch and Exynos 2500
To Be Fair the article already mentioned that SF3 do not have a Inner spacer and that sound like it is not a nice to have thing.

To Be Fair SF3 is the simple form of GAA and 18A GAA in the article make Intel 18A sound like the real deal.

The linked article also written in such a way that lets forget SF3
 
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