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China-based CXMT's aggressive production expansion may disrupt global DRAM market

The GDP1BFLM package contains a single 2 Gb CXMT G3 DDR3L SDRAM die. The DDR3L SDRAM (HUANGSHAN4G) die measures 6.26 mm × 6.31 mm (39.50 mm2) as measured from the die seals or 6.30 mm ×6.36 mm (40.07 mm2) for the full die. The die was manufactured using a DRAM CMOS process incorporating four back-end of line (BEOL) interconnect layers, one tungsten (W), two copper (Cu), one aluminum (Al), with bit line (BL) under capacitors and a buried word line (WL) forming the gate of the buried cell array transistor (BCAT).

Only 0.05 Gb/mm2?!
That is a DDR3L memory for legacy devices. What is the point in increasing the memory density more if the memory controller probably won't even support it.
 
That is a DDR3L memory for legacy devices. What is the point in increasing the memory density more if the memory controller probably won't even support it.
It's a surprising waste of the advanced G3 process from CXMT. On their LPDDR4X product, the density was 0.17-0.18 Gb/mm2: https://www.techinsights.com/blog/cxmt-cxdb6ccdm-ma-g3-8gb-lpddr4x-memory-floorplan-analysis

The Samsung 18 nm 8 Gb DRAM die has a density of 0.189 Gb/mm2: https://www.techinsights.com/blog/s...higher-uniformed-capacitor-high-k-dielectrics
 
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Are you talking about Nanya and Windbond?
Yes. Obviously CXMT has preferential access to China's market etc but they can only inhabit the space behind the mainstream because they are way behind on product tech.

Also, don't forget, the gap between what they say they are doing versus what they are actually doing is huge.
 
The real long-term outlook should be like the auto industry. Each company should sell their products within its borders, fair and square.
That's not how the auto industry works. Hasn't been since WWII.

Mercedes-Benz sells 3 cars in China for every 1 in Germany and more in the US than in Germany.

I'm really not sure where your argument is heading here ...
 
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