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TSMC Breaks Ground on €10 Billion German Plant in Chip War Salvo

Daniel Nenni

Admin
Staff member
(Bloomberg) -- Taiwan Semiconductor Manufacturing Co. broke ground in eastern Germany on its first European plant as the continent seeks to safeguard its chip supplies amid growing US-China tensions.

“We are dependent on semiconductors for our sustainable future technologies, but we must not be dependent on other regions of the world for the supply of semiconductors,” said German Chancellor Olaf Scholz, who attended a ceremony on Tuesday to mark the start of construction of the €10 billion ($11 billion) fab in the city of Dresden. About half of the funding will be covered by state subsidies.

Germany is leading the European Union push to produce one-fifth of the world’s semiconductors by 2030, with the bloc seeking to build up capacity following Covid-era disruptions and as the relationship between Washington and Beijing deteriorates. The US, Japan and others are also showering subsidies on the chip industry to localize production of the components that control everything from cutting-edge artificial intelligence to everyday gadgets.

TSMC is the world’s biggest contract chipmaker, with Apple Inc. and Nvidia Corp. relying on it for their most important products. It will anchor the Dresden project with a 70% stake in the plant, which will produce chips for the automotive and industrial sectors.


TSMC's €10 billion Semiconductor Plant Ground-Breaking in Eastern Germany

TSMC's €10 billion Semiconductor Plant Ground-Breaking in Eastern Germany© Bloomberg

TSMC Chief Executive Officer C.C. Wei attended the event together with European Commission President Ursula von der Leyen and the heads of Infineon Technologies AG, NXP Semiconductors NV and Robert Bosch GmbH, which each hold a 10% stake in the venture.

Scholz has emerged as Europe’s biggest backer of the semiconductor industry as he seeks to promote Germany’s tech sector and secure supplies of critical components for the country’s manufacturing businesses.


His government plans to spend €20 billion to bolster domestic chip production. That includes the TSMC plant and €10 billion in aid for a planned Intel Corp. plant in Magdeburg.

The EU approved Germany’s €5 billion subsidy for the Dresden fab, von der Leyen said at the event.

The new site will help Europe reduce its reliance on Asia for importing vital technology and comes after German carmakers including Volkswagen AG and Porsche AG expressed interest in boosting domestic chip production.

Production is slated to begin by the end of 2027.

Semiconductor production became a top priority for governments around the world when Covid-19 lockdowns exposed how vulnerable economies are to supply chain disruptions. Chip shortages shut down car factories around the world and took years to iron out.

The growing geopolitical rift between Washington and Beijing has raised the stakes. China is the biggest market for semiconductors and is seeking to produce more, and more sophisticated, chips domestically. The US has responded by attempting to limit its development with export controls and tariffs, citing national security concerns.


TSMC's €10 billion Semiconductor Plant Ground-Breaking in Eastern Germany

TSMC's €10 billion Semiconductor Plant Ground-Breaking in Eastern Germany© Bloomberg

Tensions over Taiwan, where the bulk of TSMC’s production is based, have contributed to the company’s expansion abroad. Beijing considers Taiwan a part of its territory, and an economic blockade or conflict over the island would massively disrupt the global supply chain.

This year TSMC opened its first plant in Japan and it has pledged to build three advanced plants in the US state of Arizona with total investments exceeding $65 billion.

 
When was the last time a major fab was built in Europe? What are the most modern Fabs in Continental Europe (not Ireland)
 
European Commission President Ursula von der Leyen, third left, Taiwan Semiconductor Manufacturing Co (TSMC) chief executive officer C.C. Wei, fourth left, German Chancellor Olaf Scholz, fourth right, and other dignitaries attend the groundbreaking ceremony for the new European Semiconductor Manufacturing Co (ESMC) plant in Dresden, Germany, yesterday.

1724184010103.png
 
Today, we broke ground for the ESMC 300mm fab in Dresden. Together with TSMC, Bosch and NXP Semiconductors, we are bringing key semiconductor technologies to Europe which are the base for a broad variety of modern digital chips serving many applications.

This is a milestone for our industry. It will be the EU's first FinFET capable foundry. Manufacturing will be based on 28-12nm technology. The chips made in Dresden will be key to serve the long-term growing demand of our customers in Europe.

With TSMC, we are adding a real heavyweight to the European semiconductor ecosystem. It will bring us advanced capabilities to develop innovative technologies, products and solutions that are key to drive decarbonization and digitalization. Together.

Jochen HanebeckJochen Hanebeck CEO Infineon Technologies
 
Today, we broke ground for the ESMC 300mm fab in Dresden. Together with TSMC, Bosch and NXP Semiconductors, we are bringing key semiconductor technologies to Europe which are the base for a broad variety of modern digital chips serving many applications.

This is a milestone for our industry. It will be the EU's first FinFET capable foundry. Manufacturing will be based on 28-12nm technology. The chips made in Dresden will be key to serve the long-term growing demand of our customers in Europe.

With TSMC, we are adding a real heavyweight to the European semiconductor ecosystem. It will bring us advanced capabilities to develop innovative technologies, products and solutions that are key to drive decarbonization and digitalization. Together.

Jochen HanebeckJochen Hanebeck CEO Infineon Technologies

TW did all these to compensate for the losses the EU suffered due to lost tool sales to China.
and cheaper wafers if china can get all the tools they need.
 
This will obviously go better than Az, not hard to as that bar of schedule, cost and culture clash is hard to beat. Amazing they haven’t fired the leaders there as the risks have been a black eye embarrassment to all that TSMC did in Taiwan. Proves their leadership down to fab director are incapable of adaptation or any kind.
 
The ST FAB in Crolles France I think , they just added a new extension , does that count?

If extensions don´t count, my guess would the Infineon Villach fab which started production in 2021.

-- edit --
Other bigger projects I am aware of:
- ST Catania (extension)
- Infineon Dresden (extension)
- onsemi Roznov (extension)
- Bosch Dresden

Interestingly all of those projects focus on power electronics and mature technology instead of advanced logic. Must reflect the European market quite well.
 
If extensions don´t count, my guess would the Infineon Villach fab which started production in 2021.

-- edit --
Other bigger projects I am aware of:
- ST Catania (extension)
- Infineon Dresden (extension)
- onsemi Roznov (extension)
- Bosch Dresden

Interestingly all of those projects focus on power electronics and mature technology instead of advanced logic. Must reflect the European market quite well.
Again, it's about resources. The EU is also seriously divided. They used to have DRAM/NAND business, but all failed. It's not that they don't need DRAM; they just can't sustain it.
 
From LinkedIn:
1724252919307.png


Jannis Kaliske • 2nd • Dipl. Eng. Industrial Engineering@TUD | STIPT@NTU&TSMC | Rotaract | KASDipl. Eng. Industrial Engineering@TUD | STIPT@NTU&TSMC | Rotaract | KAS3h • Edited • 3 hours ago

In an unexpected turn of events, I found myself handing ceremonial shovels to Olaf Scholz, the German Chancellor and to TSMC CEO C.C. Wei for the official groundbreaking moment. It was a surreal experience that bridged my practical training in Taiwan with this landmark event in my home country.

Yesterday marked a historic moment for the semiconductor industry in Europe. I had the privilege of attending the groundbreaking ceremony for TSMC first European fab in Dresden+, Germany. As someone who recently completed an 8-week practical training with the hashtag#SemiconductorTalentIncubationProgramTaiwan at TSMC mother plant Fab 15A in Taichung, Taiwan, this event held special significance for me.

The ceremony brought together industry titans and political leaders, including Olaf Scholz, European Commission President Ursula von der Leyen, CEO C.C. Wei, and Infineon CEO Jochen Hanebeck. The energy was palpable as these figures, among other semiconductor giants, came together to celebrate a new era of semiconductor manufacturing in Europe.

My recent experience at TSMC Taichung gave me unique insights into the company's operations and culture. Witnessing the expansion to Europe firsthand was a powerful reminder of the global impact and rapid growth of this industry.

This groundbreaking represents more than just a new factory; it's a commitment to technological advancement, economic growth, and strategic autonomy for Europe in the crucial semiconductor sector. And then I suddenly found myself due to a coincident in the situation of handing over the shovels to these two giants of politics and economy. A funny story to remember that I played a small role in the success story of chips made in Europe.

As I reflect on my journey from Taichung to Dresden+, I'm excited for the future of semiconductor manufacturing in Europe and grateful for the opportunity to have played a small part in both chapters of TSMC story.

A heartfelt thanks to the lithography team at TSMC Taichung. Your expertise and warmth made my eight-week training both insightful and enjoyable. The knowledge gained and connections made in such a short time are truly invaluable. Your dedication to fostering growth and innovation is inspiring.
 

Jochen HanebeckJ CEO Infineon Technologies
Following the groundbreaking of the #ESMC fab this week, it has been a pleasure to welcome TSMC CEO C.C. Wei and parts of the leadership team at our Infineon Technologies site in Dresden to discuss our joint activities in the context of ESMC and beyond.

We are proud to have a long-standing partnership with TSMC. Our companies share a commitment to advancing innovation in the semiconductor industry. We look forward to expanding our successful collaboration in the future and continuing to drive #decarbonization and #digitalization. Together.

EMC Dig TSMC Infineon.jpg
 
This will obviously go better than Az, not hard to as that bar of schedule, cost and culture clash is hard to beat. Amazing they haven’t fired the leaders there as the risks have been a black eye embarrassment to all that TSMC did in Taiwan. Proves their leadership down to fab director are incapable of adaptation or any kind.
I would wait to see how the Arizona story ends before passing judgement. TSMC AZ may be the best and most profitable fab complex in the US in 4 years. I believe Intel is currently trying to adapt its fabs to be more like TSMC so that they can hopefully break even someday. Lets see what Intel and TSMC AZ looks like at the end of 2025. Just an opinion
 
TSMC AZ has EUV so a bit more complex on the manufacturing side than Japan or Dresden. The N5/N4/N3 recipe however is in HVM and yielding well so it should just be a copy exact type of situation for AZ.

 
Dresden used to be one of the major chip manufacturing centers in Eastern Germany (GDR). The GDR had the best semiconductor fabrication facilities in the entire Eastern Block. Better than the ones the Soviets had.

Today they host several fabs including for GlobalFoundries and Infineon. So I doubt TSMC will have much trouble with recruitment.

German bureaucracy is legendary so it would not be surprising if there were delays. But given this is in former East Germany, still a financially depressed part of Germany, they may try to expedite things.
 
Dresden used to be one of the major chip manufacturing centers in Eastern Germany (GDR). The GDR had the best semiconductor fabrication facilities in the entire Eastern Block. Better than the ones the Soviets had.

Today they host several fabs including for GlobalFoundries and Infineon. So I doubt TSMC will have much trouble with recruitment.

German bureaucracy is legendary so it would not be surprising if there were delays. But given this is in former East Germany, still a financially depressed part of Germany, they may try to expedite things.

I did a fab tour in Europe and Russia 10 years ago. Russia was horribly behind but the GF fabs in Dresden were not bad at all in regards to automation. Nothing like you see today with the Intel and TSMC fabs though. I think TSMC will do okay in Dresden since they are partnered up with big German companies. It is much more like Japan than AZ where TSMC went it alone. Hopefully TSMC is looking at India for a fab partnership. The funny thing is that the GlobalFoundries strategy was to be a global foundry and here TSMC is kicking global ass. Exciting times in the semiconductor industry, absolutely.
 
I did a fab tour in Europe and Russia 10 years ago. Russia was horribly behind but the GF fabs in Dresden were not bad at all in regards to automation. Nothing like you see today with the Intel and TSMC fabs though. I think TSMC will do okay in Dresden since they are partnered up with big German companies. It is much more like Japan than AZ where TSMC went it alone. Hopefully TSMC is looking at India for a fab partnership. The funny thing is that the GlobalFoundries strategy was to be a global foundry and here TSMC is kicking global ass. Exciting times in the semiconductor industry, absolutely.

I thought about why TSMC has partners in Germany (Bosch, NXP, Infineon) and in Japan (Sony, Denso, Toyota) in establishing new fabs while chose to go alone in Arizona. The reason is very simple: it will be too complicated.

There are two groups of companies who may be interested to invest in TSMC Arizona fabs. The first group of potential investors are Apple, AMD, Nvidia, Qualcomm, Broadcom and possible TI. One way or the other they are competitors to each other and they are just too big to sit in one room. It can become a nightmare for TSMC to make them to play nicely with each other in the TSMC conference room.

The second group of potential investors are Microsoft, Google, Amazon, Facebook, Oracle, and Tesla. Again, they are big and are competing against each other all the time. It can be another nightmare for TSMC to find a way to please all of them.

So TSMC must go alone for its Arizona project without additional investors like it did in Japan and Germany.
 
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