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Description Multi-die designs allow systems engineering to pack more functionality with different timing and power constraints into a single package. Older generation multi-die split the dies into high-speed and low speed. Newer, high-performance multi-die System-on-Chip (SoC) requires interaction between memories across the die-to-die interfaces. Connections between dies must be power efficient, have low latency, provide …
Tuesday, February 21, 2023 8:00 am PT / 11:00 am ET UCIe™ — Universal Chiplet Interconnect Express™ — is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers to address customer requests for more customizable package-level integration. The newly formed UCIe Consortium fosters an open chiplet …
Synopsys Webinar | Thursday, August 10, 2023 | 9-10 a.m. Pacific As traditional Moore’s law scaling approaches its physical limits, the industry is moving towards multi-die solutions for higher electronics system densities. Multi-die designs present one way for engineers to pack more functionality into silicon chips and improve yield without affecting fabrication feasibility or project …
Synopsys Webinar | Tuesday, August 15, 2023 | 10:00 -11:00 a.m. PDT High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure to meet the demands of today’s data centers, autonomous vehicles, etc. On-package interconnects are a critical component to deliver the power-efficient performance for this evolving landscape. Universal Chiplet Interconnect …
Date: Wednesday, August 30, 2023 Time: 11:00am PDT | 1:00pm CDT | 2:00pm EDT Innovative die disaggregation technologies, enable a future where a catalog of chiplets will be available to mix and match based on the end application. The industry’s fastest emerging interconnect standard called Universal Chiplet Interconnect Express (UCIe) enables end users to combine chiplets …
About Innovative die disaggregation technologies, enable a future where a catalog of chiplets will be available to mix and match based on the end application. The industry’s fastest emerging interconnect standard called Universal Chiplet Interconnect Express (UCIe) enables end users to combine chiplets with different functionality and technology nodes to develop highly sophisticated electronic chips. …
The UCIe™ 1.1 Specification: Future Applications of ChipletsThursday, October 12, 2023 10 AM PT / 1 PM ET Presenter: Dr. Debendra Das Sharma, UCIe Consortium Chairman and Intel Senior Fellow, Chief Architect of I/O Technology and Standards at Intel The UCIe™ (Universal Chiplet Interconnect Express™) 1.1 Specification was released in August 2023, delivering valuable improvements to the …
Summary Conventional monolithic SoCs are becoming a bottleneck for power, performance, and area (PPA), creating limitations for Data-intensive applications like high-performance computing (HPC), machine learning (ML) and artificial intelligence (AI), and for hyperscale data centers. These bottlenecks are challenging Moore’s law, hindering the industry’s ability to continue scaling designs. Chiplets are rapidly becoming the means to …
Thursday, February 8, 2024 | 9-10 a.m. PT The Universal Chiplet Interconnect Express (UCIe) v1.0 standard was introduced in March of 2022 and v1.1 was published in July 2023. There is a huge demand for an open chiplet ecosystem that will unleash innovation across the compute continuum which in turn increases the demand for power …
