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ANSYS Icepak and Sherlock For Temperature Cycling

March 24, 2020 12:00 PM - 1:00 PM (EDT) Venue: Online Temperature cycling of printed circuit boards can cause failures due to solder fatigue. This is a thermomechanical process that happens due to a mismatch in the coefficients of thermal expansion (CTEs) between the PCB and the components. Too often, the thermal and mechanical simulations …

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