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Webinar: Multi-Die System Verification with Siemens Avery UCIe VIP
Webinar: Multi-Die System Verification with Siemens Avery UCIe VIP
Summary Conventional monolithic SoCs are becoming a bottleneck for power, performance, and area (PPA), creating limitations for Data-intensive applications like high-performance computing (HPC), machine learning (ML) and artificial intelligence (AI), …
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