In this webinar, Marvell will present how its team accelerates passive interposer routing for advanced 2.5D/3.5D multi die designs by bringing early, physics based signal integrity feedback into each routing …
Physical AI is increasingly popular in applications requiring real-time decision making and autonomous operation. Different from NPUs for cloud platforms, Physical AI processors can be made application-specific. By jointly tuning …
Continue reading "Webinar: Application-Specific Processors (ASIPs) for Physical AI"
As semiconductors continue to scale, designers are turning to 3DIC architectures to meet increasing demands for performance, energy efficiency, and functional density in data centers and edge AI applications. However, …
Continue reading "Webinar: Powering 3D Multi-Die Designs with RedHawk-SC Electrothermal"
As power integrity challenges increase with advanced nodes and multi-die architectures, EMIR analysis must evolve beyond traditional signoff. In this Synopsys webinar, we will show how RedHawk-SC is expanding its capabilities …
Continue reading "Webinar: RedHawk-SC: From EMIR Signoff to IR-Aware Design Closure"
