As the leading global lithography event, the technical program will focus on works in optical lithography, metrology, and EUV. Leaders come to solve challenges in lithography, patterning technologies, and unique materials, while sharing the latest advancements in the semiconductor industry. Browse papers in the program. Attend and hear the latest research. • Extreme Ultraviolet (EUV) Lithography …
Interlaken chip-to-chip connectivity IP has been used for many years in networking and switching fabrics to move high throughput data between large chips. With advanced technology nodes, increasing chip sizes and CPU cluster-based designs, Interlaken has found a unique spot as the protocol of choice for low latency, high throughput chip-to-chip connectivity. SiFive is extending …
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The LLVM Developers' Meeting is a bi-annual 2 day gathering of the entire LLVM Project community. The conference is organized by the LLVM Foundation and many volunteers within the LLVM community. Developers and users of LLVM, Clang, and related subprojects will enjoy attending interesting talks, impromptu discussions, and networking with the many members of our …
If you are working on complex Artificial Intelligence (AI) or Machine Learning (ML) or Deep Learning (DL) designs using advanced node processes, you will understand the motivations for optimising CPU utilisation, device power and processing speed. Cutting-edge AI, ML & DL chips, by their very nature, are susceptible to intra-die process variability. Designers are often …
